Photo-curable resins and the evaluation methods for UV-nanoimprint lithograohy

IEEJ Transactions on Electronics, Information and Systems

Volumn 127, Issue 2, 2007, Pages 174-178

  Hirasawa, Tamano ^a   Taniguchi, Jun ^b   Ohtaguchi, Makoto ^a   Sakai, Nobuji ^a  

^a TOYO GOSEI CO LTD   (Japan)

^b TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

Adhesive force; Glass transition temperature; Mold; Photo curable resin; UV nanoimprint

Indexed keywords

CURING; ELASTIC MODULI; GLASS TRANSITION; LASER INTERFEROMETRY; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMODYNAMIC PROPERTIES; THERMODYNAMIC STABILITY;

ADHESIVE FORCE; LINEAR EXPANSION COEFFICIENT; PHOTO CURABLE RESIN;

NANOIMPRINT LITHOGRAPHY;

EID: 33847744587     PISSN: 03854221     EISSN: 13488155     Source Type: Journal    
DOI: 10.1541/ieejeiss.127.174     Document Type: Article

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