Novel poly(benzoxazole-etherimide) copolymer for two-layer flexible copper-clad laminate

Journal of Macromolecular Science, Part B: Physics

Volumn 51, Issue 11, 2012, Pages 2157-2170

  Zhuang, Yongbing ^a   Gu, Yi ^a  

^a SICHUAN UNIVERSITY   (China)

Author keywords

adhesion strength; copolymer; flexible copper clad laminate; polyimide; properties; two layer

Indexed keywords

ADHESION PROPERTIES; AGGREGATION STRUCTURE; BONDING STRENGTH; COHESIVE STRENGTH; COPPER FOILS; COPPER-CLAD LAMINATES; FILM TOUGHNESS; MOLAR RATIO; PI FILM; POLY(AMIC ACID); PROPERTIES; TWO-LAYER;

ADHESION; BOND STRENGTH (MATERIALS); COPOLYMERS; COPPER; FILM PREPARATION; NITROGEN COMPOUNDS; POLYIMIDES;

LAMINATES;

EID: 84865716846     PISSN: 00222348     EISSN: 1525609X     Source Type: Journal    
DOI: 10.1080/00222348.2012.665779     Document Type: Article

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