Adhesion of an aromatic thermosetting copolyester with copper foils

Polymers for Advanced Technologies

Volumn 16, Issue 1, 2005, Pages 1-5

  Huang, Yongqing ^a   McCormick, John J ^a   Economy, James ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Adhesion; High temperature materials; Interface; Peel strength; Polyester

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; CURING; HIGH TEMPERATURE OPERATIONS; INTERFACES (MATERIALS); METAL FOIL; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; THERMOSETS; X RAY PHOTOELECTRON SPECTROSCOPY;

AROMATIC THERMOSETTING COPOLYESTERS (ATSP); COPPER FOILS; HIGH TEMPERATURE ADHESIVES; MECHANICAL INTERLOCKING;

POLYESTERS;

POLYMER SCIENCE;

EID: 13344282029     PISSN: 10427147     EISSN: None     Source Type: Journal    
DOI: 10.1002/pat.544     Document Type: Article

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