Deformation and stress build-up in bi-material beam specimens with a curing FM300 adhesive interlayer

Composites Part A: Applied Science and Manufacturing

Volumn 39, Issue 2, 2008, Pages 252-261

  Curiel, Tomer ^a   Fernlund, Göran ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

A. Thermosetting resin; B. Thermomechanical; E. Joints joining

Indexed keywords

CURING; DEFORMATION; MATHEMATICAL MODELS; RESIDUAL STRESSES; STRESS ANALYSIS;

ADHESIVE INTERLAYER; CURE TEMPERATURE; WARPAGE;

BEAMS AND GIRDERS;

EID: 38749151541     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2007.10.019     Document Type: Article

References (20)

1. Chester R.J., Walker K.F., and Chalkley P.D. Adhesively bonded repairs to primary aircraft structures. Int J Adhes Adhes 19 1 (1999) 1-8
2. Ong C.L., and Shen S.B. The reinforcing effect of composite patch repairs on metallic aircraft structures. Int J Adhes Adhes 12 1 (1992) 19-26
3. Cho J., and Sun C.T. Lowering thermal residual stresses in composite patch repairs in metallic aircraft structures. AIAA J 39 10 (2001) 2013-2018
4. Davis M., and Bond D. Principles and practices of adhesive bonded structural joints and repairs. Int J Adhes Adhes 19 2-3 (1999) 91-105
5. Baker A.A., and Chester R.J. Recent advances in bonded composite repair technology for metallic aircraft components. Adv Compos '93 TMS (1993) 45-49
6. Kerr A., and Ruddy J. Development of a bonded repair for the F-16FS479 bulkhead vertical tail attach bosses. Appl Compos Mater 6 4 (1999) 239-249
7. Bartholomeusz R.A., Baker A.A., Chester R.J., and Searl A. Bonded joints with through-thickness adhesive stresses - reinforcing the F/A-18 Y470.5 bulkhead. Int J Adhes Adhes 19 2-3 (1999) 173-180
8. Baker A.A., Rose L.R.F., Walker K.F., and Wilson E.S. Repair substantiation for a bonded composite repair to F111 lower wing skin. Appl Compos Mater 6 4 (1999) 251-267
9. Jones R., Molent L., and Pitt S. Study of multi-site damage of fuselage lap joints. Theor Appl Fract Mech 32 2 (1999) 81-100
10. Djokic D., Johnston A., Rogers A., Lee-Sullivan P., and Mrad N. Residual stress development during the composite patch bonding process: measurement and modeling. Compos A Appl Sci Manuf 33 2 (2002) 277-288
11. Kim K.S., and Hahn H.T. Residual stress development during processing of graphite/epoxy composites. Comp Sci Tech 36 (1989) 121-132
12. White S.R., and Hahn H.T. Cure cycle optimization for the reduction of processing-induced residual-stresses in composite-materials. J Comp Mat 27 14 (1993) 1352-1378
13. Ramani K., and Zhao W.P. The evolution of residual stresses in thermoplastic bonding to metals. Int J Adhes Adhes 17 4 (1997) 353-357
14. DeMeuse M.T., Gillham J.K., and Parodi F. Evolution of properties of a thermosetting isocyanate/epoxy/glass fiber model composite system with increasing cure. J Appl Poly Sci 64 1 (1997) 27-38
15. g) and fractional conversion for thermosetting systems. J Appl Poly Sci 64 1 (1997) 3-14
16. Sourour S., and Kamal M.R. Differential scanning calorimetry of epoxy cure - isothermal cure kinetics. Thermochim Acta 14 1-2 (1976) 41-59
17. Shutilin Y.F. On application of Williams-Landel-Ferry and Arrhenius equations to description of relaxational properties of polymers and polymer homologs. Vysokomol Soedin Seriya A 33 1 (1991) 120-127
18. Rogers A.D., and Lee-Sullivan P. An alternative model for predicting the cure kinetics of a high temperature cure epoxy adhesive. Pol Eng Sci 43 1 (2003) 14-25
19. Djokic D., Hojjati M., Johnston A., and Lee-Sullivan P. Process Optimization for Reduction of Composite Patch Repair Residual Stresses. 33rd Int SAMPE Tech Conf 33 (2001) 356-368
20. Hojjati M, Johnson A. Closed-form solution for residual stress development in a simple single-sided bonded patch repair. NRC/IAR report 2002.