Polyurethane modified epoxy adhesives for the application to FCCL

Macromolecular Symposia

Volumn 249-250, Issue , 2007, Pages 654-659

  Baek, Jung Ok ^a   Park, Sun Joo ^a   Gong, Hui Jin ^a   Kim, Wonho ^a  

^a Pusan National University   (South Korea)

Author keywords

Adhesive; Curing; Epoxy; FCCL; Polyurethane

Indexed keywords

ADHESIVES; CHEMICAL MODIFICATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIMENSIONAL STABILITY; GLASS TRANSITION; POLYURETHANES;

EPOXY ADHESIVES; HEAT CYCLE TREATMENTS; PEEL STRENGTH;

EPOXY RESINS;

EID: 34547172169     PISSN: 10221360     EISSN: 15213900     Source Type: Journal    
DOI: 10.1002/masy.200750451     Document Type: Conference Paper

References (10)

1. Ching-Fen Yeh, Tsui-Shuang Wang, Jong-Yuh Cherng, Jung-Hua Steven Kuo, Min-Da Shua, J. Appl. Polym. Sci 2002, 86, 141.
2. Ginu Abrahan, S. Packirisamy, K. Adhinarayanan, A. G. Feby, R. Ramaswamy, J. Appl Polym.Sci. 2000, 78, 1729.
3. Hiroaki Yamaguchi, J. Photopolym. Sci. Technol. 2003, 16, 233.
4. Ichino, Toshihiro, Hasuda, Yoshonori, J. Appl. Polym. Sci 1987, 34. 1667.
5. Jiru Meng, Guozheng Liang, Lei Zhao, Composition Sci Technol. 2002, 62, 783.
6. B. S. Rao, J. Polym. Sci. Lett. 1988, 26, 3.
7. B. S. Rao, J. of Polym Sci. Part C: Polym Lett. 1989, 27, 133.
8. Tsui-Shuang Wang, Jong-Kae Parng, Min-Da Shau, J. Appl. Polym. Sci 1999, 74, 413.
9. Tsui-Shuang Wang, Jin-Fen Yeh, Min-Da Shau, J. Appl. Polym. Sci. 1996, 59, 215.
10. Wei-Kuo Chin, Min-Da Shau, Wei-Chun Tsai, J. Polym. Sci part A: Polym. Chem. 1995, 33, 373.