Rheology study of wafer level underfill

Macromolecular Materials and Engineering

Volumn 290, Issue 12, 2005, Pages 1204-1212

  Sun, Yangyang ^a   Zhang, Zhuqing ^a   Wong, Ching Ping ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Chemorheology; Epoxy; Step polymerization; Underfill

Indexed keywords

CURING; ELECTRONICS PACKAGING; EPOXY RESINS; MOLECULAR WEIGHT; RHEOLOGY; VISCOSITY;

CHEMORHEOLOGY; WAFER LEVEL UNDERFILL (WLU);

SILICON WAFERS;

EID: 29844449091     PISSN: 14387492     EISSN: None     Source Type: Journal    
DOI: 10.1002/mame.200500149     Document Type: Article

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