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Volumn 293, Issue 10, 2008, Pages 832-835

Sigmoidal chemorheological models of chip-underfill materials offer alternative predictions of combined cure and flow

Author keywords

Chemorheology; Crosslinking; Epoxy; Rheology; Thermosets

Indexed keywords

CHEMORHEOLOGICAL MODELS; CHEMORHEOLOGY; CRITICAL DESIGN PARAMETERS; DWELL TIMES; DYNAMIC CHANGES; DYNAMIC VISCOSITIES; EPOXY; LOGICAL MODELS; NON LINEARITIES; ON CHIPS; PHYSICAL PARAMETERS; PRACTICAL USES; SIGMOIDAL MODELS; TIME FACTORS; UNDERFILL; UNDERFILL EPOXIES; UNDERFILL MATERIALS; WIDER RANGES;

EID: 55149108088     PISSN: 14387492     EISSN: 14392054     Source Type: Journal    
DOI: 10.1002/mame.200800170     Document Type: Article
Times cited : (18)

References (26)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.