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Volumn 293, Issue 10, 2008, Pages 832-835
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Sigmoidal chemorheological models of chip-underfill materials offer alternative predictions of combined cure and flow
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Author keywords
Chemorheology; Crosslinking; Epoxy; Rheology; Thermosets
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Indexed keywords
CHEMORHEOLOGICAL MODELS;
CHEMORHEOLOGY;
CRITICAL DESIGN PARAMETERS;
DWELL TIMES;
DYNAMIC CHANGES;
DYNAMIC VISCOSITIES;
EPOXY;
LOGICAL MODELS;
NON LINEARITIES;
ON CHIPS;
PHYSICAL PARAMETERS;
PRACTICAL USES;
SIGMOIDAL MODELS;
TIME FACTORS;
UNDERFILL;
UNDERFILL EPOXIES;
UNDERFILL MATERIALS;
WIDER RANGES;
ABS RESINS;
COLLOIDS;
CURING;
ELASTICITY;
EPOXY RESINS;
GELATION;
HYDRODYNAMICS;
PLASTICITY;
RESINS;
RHEOLOGY;
THERMOSETS;
VISCOSITY;
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EID: 55149108088
PISSN: 14387492
EISSN: 14392054
Source Type: Journal
DOI: 10.1002/mame.200800170 Document Type: Article |
Times cited : (18)
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References (26)
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