Phosphorus-containing liquid cycloaliphatic epoxy resins for reworkable environment-friendly electronic packaging materials

Polymer

Volumn 51, Issue 21, 2010, Pages 4776-4783

  Liu, Wanshuang ^a   Wang, Zhonggang ^a   Xiong, Li ^a   Zhao, Linni ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electronic packaging; Epoxy resin; Synthesis

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS; GLASS TRANSITION; MICROELECTRONICS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PHOSPHORUS; PHOTODEGRADATION; PYROLYSIS; SUBSTRATES; SYNTHESIS (CHEMICAL);

AFTER-HEAT TREATMENT; CYCLOALIPHATIC EPOXY RESINS; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING MATERIAL; HIGH-GLASS TRANSITION TEMPERATURES; LIMITING OXYGEN INDEX; OPTOELECTRONIC PACKAGING; THREE-DIMENSIONAL NETWORKS;

PACKAGING MATERIALS;

EID: 77956910477     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2010.08.039     Document Type: Article

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