Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Composites Science and Technology

Volumn 69, Issue 2, 2009, Pages 260-264

  Yung, K C ^a   Zhu, B L ^a   Yue, T M ^a   Xie, C S ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

A. Functional composites; A. Polymer matrix composites (PMCs); B. Electrical properties; B. Thermal properties; D. Scanning electron microscopy (SEM)

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; CERAMIC CAPACITORS; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES; DIELECTRIC WAVEGUIDES; ELECTRIC PROPERTIES; FILLERS; FUNCTIONAL POLYMERS; GLASS; GLASS TRANSITION; INERTIAL CONFINEMENT FUSION; METALLIC MATRIX COMPOSITES; MICROSPHERES; PERMITTIVITY; POLYMER MATRIX COMPOSITES; SCANNING; SCANNING ELECTRON MICROSCOPY; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL INSULATING MATERIALS; THERMAL SPRAYING; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

A. FUNCTIONAL COMPOSITES; A. POLYMER-MATRIX COMPOSITES (PMCS); B. ELECTRICAL PROPERTIES; B. THERMAL PROPERTIES; D. SCANNING ELECTRON MICROSCOPY (SEM);

EPOXY RESINS;

COMPOSITE; DIELECTRIC PROPERTY; GLASS FIBER; GLASS TRANSITION TEMPERATURE; THERMAL EXPANSION;

EID: 57749111839     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2008.10.014     Document Type: Article

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