Wafer bumping, assembly, and reliability of fine-pitch lead-free micro solder joints for 3-D IC integration

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 8, 2012, Pages 1229-1238

  Lee, Ching Kuan ^a   Chang, Tao Chih ^a   Lau, John H ^a   Huang, Yu Jiau ^a   Fu, Huan Chun ^a   Huang, Jui Hsiung ^a   Hsiao, Zhi Cheng ^a   Ko, Cheng Ta ^a   Cheng, Ren Shin ^a   Chang, Pei Chen ^a   Kao, Kuo Shu ^a   Lu, Yu Lan ^a   Lo, Robert ^a   Kao, Ming Jer ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Assembly; fine pitch solder; lead free solder microbumps; reliability

Indexed keywords

CHIP SIZES; CHIP-TO-WAFER BONDING TECHNIQUES; ELECTROPLATING TECHNIQUE; HEIGHT VARIATION; LAYER THICKNESS; LEAD FREE SOLDERS; LEAD-FREE; MICRO GAPS; MICRO-BUMPS; MICROBUMPING; RELIABILITY ASSESSMENTS; SCANNING ACOUSTIC TOMOGRAPHIES; SCANNING ELECTRONS; SHEAR TESTS; SI WAFER; SOLDER JOINTS; UNDERFILLS; WAFER BUMPING;

ASSEMBLY; ELECTROPLATING; RELIABILITY; RELIABILITY ANALYSIS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SPECIFICATIONS; TIN; WET ETCHING;

WAFER BONDING;

EID: 84864723913     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2189397     Document Type: Article

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