Finite element modeling of channel sag in LTCC

Microelectronics International

Volumn 29, Issue 3, 2012, Pages 145-152

  Horvath, Eszter ^a   Henap, Gabor ^a   Harsanyi, Gabor ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Ceramics; Channel deformation; Deformation; Finite element model; Lamination; Low temperature co fired ceramics; Microfluidics

Indexed keywords

CERAMIC PRODUCTS; DEFORMATION; FLUIDIC DEVICES; LAMINATING; MICROFLUIDICS; STARCH; SUBSTRATES; TEMPERATURE;

CERAMICS; DESIGN/METHODOLOGY/APPROACH; LAMINATION; LOW TEMPERATURE CO FIRED CERAMIC(LTCC); LOW TEMPERATURE CO-FIRED CERAMICS; MICROFLUIDIC STRUCTURES; STRESS STRAIN CHARACTERISTICS; UNIAXIAL COMPRESSION EXPERIMENT;

FINITE ELEMENT METHOD;

EID: 84864669045     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565361211252908     Document Type: Article

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