Characterization of nanostructured copper films for electromagnetic shield

COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering

Volumn 31, Issue 4, 2012, Pages 1122-1132

  Desideri, Daniele ^a   Maschio, Alvise ^a   Spolaore, Monica ^b  

^a UNIVERSITY OF PADOVA   (Italy)

^b Euratom ENEA Fusion Association ^*  (Italy)

Author keywords

Copper; Electromagnetism; Nanotechnology; Shielding; Thin films

Indexed keywords

COPPER FILMS; COPPER THIN FILM; DESIGN/METHODOLOGY/APPROACH; ELECTRICAL ANALYSIS; MAGNETRON SPUTTERING DEVICE; MAGNETRON-SPUTTERING DEPOSITION; NANOMETRICS; NANOSTRUCTURED COPPER; NANOSTRUCTURED THIN FILM; OPERATING CONDITION; SHIELDING EFFECTIVENESS;

CHARACTERIZATION; COPPER; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETISM; MAGNETRON SPUTTERING; METALLIC FILMS; NANOTECHNOLOGY; SHIELDING; THIN FILMS;

ELECTROMAGNETIC SHIELDING;

EID: 84864604520     PISSN: 03321649     EISSN: None     Source Type: Journal    
DOI: 10.1108/03321641211227366     Document Type: Article

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