Triple junction transport and the impact of grain boundary width in nanocrystalline Cu

Nano Letters

Volumn 12, Issue 7, 2012, Pages 3448-3454

  Chellali, Mohammed Reda ^a   Balogh, Zoltan ^a   Bouchikhaoui, Houari ^a   Schlesiger, Ralf ^a   Stender, Patrick ^a   Zheng, Lei ^a   Schmitz, Guido ^a  

^a UNIVERSITY OF MÜNSTER   (Germany)

Author keywords

atom probe tomography; CuNi; grain boundary diffusion; grain boundary width; Nanocrystalline metals; triple junction transport

Indexed keywords

ATOM PROBE TOMOGRAPHY; CUNI; GRAIN-BOUNDARY DIFFUSION; NANOCRYSTALLINE METAL; TRIPLE JUNCTION;

ACTIVATION ENERGY; DIFFUSION; GRAIN GROWTH;

GRAIN BOUNDARIES;

EID: 84863847019     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl300751q     Document Type: Article

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