Triple junction and grain boundary diffusion in the Ni/Cu system

Scripta Materialia

Volumn 65, Issue 4, 2011, Pages 343-346

  Chellali, M R ^a   Balogh, Z ^a   Zheng, L ^a,b   Schmitz, G ^a  

^a UNIVERSITY OF MÜNSTER   (Germany)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Atom probe tomography; Copper; Grain boundaries; Nanocrystalline metal; Triple junctions

Indexed keywords

ATOM PROBE TOMOGRAPHY; ATOMIC TRANSPORT; BI-LAYER; DIFFUSION COEFFICIENTS; GRAIN-BOUNDARY DIFFUSION; NANOCRYSTALLINE METAL; NANOCRYSTALLINE NI; TRIPLE JUNCTION;

ATOMS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; PROBES;

DIFFUSION;

EID: 80955180160     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.05.002     Document Type: Article

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