In situ preparation of epoxy-based conductive nanocomposites containing nanosilver-decorated carbon nanotubes

Wuli Huaxue Xuebao/ Acta Physico - Chimica Sinica

Volumn 28, Issue 3, 2012, Pages 711-719

  Liu, Kong Hua ^a   Liu, Lan ^a   Gao, Hong ^a   Luo, Yuan Fang ^a   Jia, De Min ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Conductive filler; Contact resistance; Low temperature sintering; Nanocomposite; Volume resistivity

Indexed keywords

EID: 84863344532     PISSN: 10006818     EISSN: None     Source Type: Journal    
DOI: 10.3866/PKU.WHXB201112213     Document Type: Article

References (32)

1. Li, Y.; Yim, M. J.; Moon, K. S.;Wong, C. P. IEEE Transactions on Advanced Packaging 2009, 32 (1), 123.
2. Li, Y.;Wong, C. P. Materials Science & Engineering R-Reports 2006, 51. 1.
3. Chen, D. P.; Qiao, X. L.; Qiu, X. L. J. Mater. Sci. 2009, 44. 1076.
4. Li, Y.; Moon, K. S.;Wong, C. P. Science 2005, 308. 1419.
5. Jiang, H.; Moon, K.; Li, Y.;Wong, C. P. Chem. Mater. 2006, 18. 2969.
6. Oh, Y.; Chun, K. Y.; Lee, E.; Kim, Y. J.; Baik, S. J. Mater. Chem. 2010, 20. 3579.
7. Ruschau, G. R.; Yoshikawa, S.; Newnham, R. E. J. Appl. Phys. 1992, 72. 953.
8. Guan, Y.; Chen, X.; Li, F. Q.; Gao, H. International Journal of Adhesion & Adhesives 2010, 30. 80.
9. Sivaramakrishnan, S.; Chia, P. J.; Yeo, Y. C.; Chua, L. L.; Ho, P. K. H. Nat. Mater. 2007, 6. 149.
10. Chou, K. S.; Huang, K. C.; Lee, H. H. Nanotechnology 2005, 16. 779.
11. Duan, J. Y.; Zhang, Q. X.;Wang, Y. L.; Guan, J. G. Acta Phys. Chim. Sin. 2009, 25. 1405.
12. Sangermano, M.; Yagci, Y.; Rizza, G. Macromolecules 2007, 40. 8827.
13. Yan, J. M.; Tao, H.W.; Zeng, M. L.; Tao, J.; Zhang, S. H.; Yan, Z. Y.;Wang, W.;Wang, J. Q. Chinese Journal of Catalysis 2009, 30. 856.
14. Hsu, S. L. C.;Wu, R. T. Mater. Lett. 2007, 61. 3719.
15. Luo, C. C.; Zhang, Y. H.; Zeng, X.W.; Zeng, Y.W.;Wang, Y. G. J. Colloid Interface Sci. 2005, 288. 444.
16. Lei, Z. L.; Fan, Y. H. Acta Phys. Chim. Sin. 2006, 22. 1021.
17. Lai, W. Z.; Zhao, W.; Yang, R.; Li, X. G. Acta Phys. Chim. Sin. 2010, 26. 1177.
18. Iijima, S. Nature 1991, 354. 56.
19. Wong, E.W.; Sheehan, P. E.; Lieber, C. M. Science 1997, 277. 1971.
20. Gao, H.; Liu, L.; Luo, Y. F.; Jia, D. M. Materials Letters 2011, 65. 3529.
21. Gao, H.; Liu, L.; Liu, K. H.; Luo, Y. F.; Jia, D. M.; Lu, J. S. Journal of Materials Science: Materials in Electronics doi: 10.1007/s10854-011-0388-8.
22. Gao, H.; Liu, L.; Luo, Y. F.; Jia, D. M.;Wang, F.; Lu, J. S. Journal of Macromolecular Science, Part B: Physics 2011, 50. 1939.
23. Liu, L.; Gao, H.; Luo, Y. F.; Jia, D. M. In Situ Synthesis of Nano-Silver/Epoxy Conductive Adhesive. CN Patent 101781541A, 2010-07-21.
24. Liu, L.; Liu, K. H.; Jia, D. M.; Luo, Y. F.; Gao, H. Synthesis of Graphene/Nano-Silver/Epoxy Conductive Adhesive. CN Patent 102153976A, 2011-08-17.
25. Zhou, T. L.;Wang, X.; Liu, X. H.; Xiong, D. S. Carbon 2009, 47. 1112.
26. Wang, A. Z.; Chen, L.; Hou, W.; Lan, Y. X.; Lu, M. G. Polym. Mater. Sci. Eng. 2007, 23 (2), 157.
27. Lee, C. K.; Hsu, K. M.; Tsai, C. H.; Lai, C. K.; Lin, I. J. B. Dalton Trans. 2004, 4 (8), 1120.
28. Lu, D. Q.; Tong, Q. K.;Wong, C. P. IEEE Transactions on Components and Packaging Technologies 1999, 22 (3), 365.
29. Brown, J.; Hamerton, I.; Howlin, B. J. Journal of Applied Polymer Science 2000, 75 (2), 201.
30. Oh, Y.; Suh, D.; Kim, Y.; Lee, E.; Mok, J. S.; Choi, J.; Baik, S. Nanotechnology 2008, 19. 495602.
31. Pothukuchi, S.; Li, Y.;Wong, C. P. Journal of Applied Polymer Science 2004, 93 (4), 1531.
32. Kirkpatrick, S. Rev. Mod. Phys. 1973, 45. 574.