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Volumn 50, Issue 10, 2011, Pages 1939-1954

Simultaneously improving electrical properties and stabilizing contact resistance of electrically conductive adhesives by using aminoaldehydes

Author keywords

adsorption; aminoaldehyde; bulk resistivity; contact resistance; deoxidization; electrically conductive adhesives

Indexed keywords

AMINOALDEHYDE; BULK RESISTIVITY; CONTACT RESISTANCE STABILITY; CONTROL SAMPLES; CURING PROCESS; DEOXIDIZATION; ELECTRICALLY CONDUCTIVE ADHESIVES; FORMAMIDES; GALVANIC CORROSION; MULTIFUNCTIONAL ADDITIVES; OPTIMAL LEVEL; PROCESSABILITY;

EID: 84863012746     PISSN: 00222348     EISSN: 1525609X     Source Type: Journal    
DOI: 10.1080/00222348.2010.549420     Document Type: Article
Times cited : (3)

References (22)
  • 1
    • 28044461540 scopus 로고    scopus 로고
    • Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
    • Jiang, H. J.; Moon, K. S.; Lu, J. X.; Wong, C. P. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. J. Electron. Mater. 2005, 34, 1432.
    • (2005) J. Electron. Mater. , vol.34 , pp. 1432
    • Jiang, H.J.1    Moon, K.S.2    Lu, J.X.3    Wong, C.P.4
  • 2
    • 33644780882 scopus 로고    scopus 로고
    • Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
    • Li, Y.; Wong, C. P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications. Mater. Sci. Eng., R. 2006, 51, 1.
    • (2006) Mater. Sci. Eng., R. , vol.51 , pp. 1
    • Li, Y.1    Wong, C.P.2
  • 3
    • 42749083803 scopus 로고    scopus 로고
    • Recent advances in isotropic conductive adhesives for electronics packaging applications
    • Irfan, M.; Kumar, D. Recent advances in isotropic conductive adhesives for electronics packaging applications. Int. J. Adhes. Adhes. 2008, 28, 362.
    • (2008) Int. J. Adhes. Adhes. , vol.28 , pp. 362
    • Irfan, M.1    Kumar, D.2
  • 4
    • 33947232734 scopus 로고    scopus 로고
    • Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes
    • Li, Y.; Moon, K. S.; Whitman, A.; Wong, C. P. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Trans. Comp. Pack. Technol. 2006, 29, 758.
    • (2006) IEEE Trans. Comp. Pack. Technol. , vol.29 , pp. 758
    • Li, Y.1    Moon, K.S.2    Whitman, A.3    Wong, C.P.4
  • 5
    • 20344373701 scopus 로고    scopus 로고
    • Electronics without lead
    • Li, Y.; Moon, K. S.; Wong, C. P. Electronics without lead. Science 2005, 308, 1419.
    • (2005) Science , vol.308 , pp. 1419
    • Li, Y.1    Moon, K.S.2    Wong, C.P.3
  • 6
    • 33846564966 scopus 로고    scopus 로고
    • Isotropic conductive adhesives: Future trends, possibilities and risks
    • Morris, J. E. Isotropic conductive adhesives: Future trends, possibilities and risks. Microelectronics. Reliab. 2007, 47, 328.
    • (2007) Microelectronics. Reliab. , vol.47 , pp. 328
    • Morris, J.E.1
  • 7
    • 0033739405 scopus 로고    scopus 로고
    • Effects of shrinkage on conductivity of isotropic conductive adhesives
    • Lu, D. Q.; Wong, C. P. Effects of shrinkage on conductivity of isotropic conductive adhesives. Int. J. Adhes. Adhes. 2000, 20, 189.
    • (2000) Int. J. Adhes. Adhes. , vol.20 , pp. 189
    • Lu, D.Q.1    Wong, C.P.2
  • 8
    • 33749320595 scopus 로고    scopus 로고
    • Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates
    • Hwang, J. S.; Yim, M. J.; Paik, K. W. Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates. J. Electron. Mater. 2006, 35, 1722.
    • (2006) J. Electron. Mater. , vol.35 , pp. 1722
    • Hwang, J.S.1    Yim, M.J.2    Paik, K.W.3
  • 9
    • 33644808213 scopus 로고    scopus 로고
    • Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids
    • Li, Y.; Moon, K. S.; Wong, C. P. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Trans. Comp. Pack. Technol. 2006, 29, 173.
    • (2006) IEEE Trans. Comp. Pack. Technol. , vol.29 , pp. 173
    • Li, Y.1    Moon, K.S.2    Wong, C.P.3
  • 10
    • 0033310472 scopus 로고    scopus 로고
    • A study of lubricants on silver flakes for microelectronics conductive adhesives
    • Lu, D. Q.; Tong, Q. K.; Wong, C. P. A study of lubricants on silver flakes for microelectronics conductive adhesives. IEEE Trans. Comp. Pack. Technol. 1999, 22, 365.
    • (1999) IEEE Trans. Comp. Pack. Technol. , vol.22 , pp. 365
    • Lu, D.Q.1    Tong, Q.K.2    Wong, C.P.3
  • 11
    • 33644886958 scopus 로고    scopus 로고
    • Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives
    • Tan, F. T.; Qiao, X. L.; Chen, J. G.; Wang, H. S. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives. Int. J. Adhes. Adhes. 2006, 26, 406.
    • (2006) Int. J. Adhes. Adhes. , vol.26 , pp. 406
    • Tan, F.T.1    Qiao, X.L.2    Chen, J.G.3    Wang, H.S.4
  • 12
    • 33746373478 scopus 로고    scopus 로고
    • Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites
    • Jiang, H. J.; Moon, K. S.; Li, Y.; Wong, C. P. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chem. Mater. 2006, 18, 2969.
    • (2006) Chem. Mater. , vol.18 , pp. 2969
    • Jiang, H.J.1    Moon, K.S.2    Li, Y.3    Wong, C.P.4
  • 14
    • 33644767350 scopus 로고    scopus 로고
    • Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
    • Li, Y.; Moon, K. S.; Wong, C. P. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. J. Appl. Polym. Sci. 2006, 99, 1665.
    • (2006) J. Appl. Polym. Sci. , vol.99 , pp. 1665
    • Li, Y.1    Moon, K.S.2    Wong, C.P.3
  • 15
    • 59349094447 scopus 로고    scopus 로고
    • Synthesis and electrical properties of uniform silver nanoparticles for electronic applications
    • Chen, D. P.; Qiao, X. L.; Qiu, X. L.; Chen, J. G. Synthesis and electrical properties of uniform silver nanoparticles for electronic applications. J. Mater. Sci. 2009, 44, 1076.
    • (2009) J. Mater. Sci. , vol.44 , pp. 1076
    • Chen, D.P.1    Qiao, X.L.2    Qiu, X.L.3    Chen, J.G.4
  • 16
    • 77953324235 scopus 로고    scopus 로고
    • Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes
    • Chen, D. P.; Qiao, X. L.; Qiu, X. L.; Tan, F. T.; Chen, J. G.; Jiang, R. Z. Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes. J. Mater. Sci.-Mater. Electron. 2010, 21, 486.
    • (2010) J. Mater. Sci.-Mater. Electron. , vol.21 , pp. 486
    • Chen, D.P.1    Qiao, X.L.2    Qiu, X.L.3    Tan, F.T.4    Chen, J.G.5    Jiang, R.Z.6
  • 17
    • 77951790087 scopus 로고    scopus 로고
    • Functionalized nano-silver particles assembled on one-dimensional nanotube scaffolds for ultra-highly conductive silver/polymer composites
    • Oh, Y.; Chun, K. Y.; Lee, E.; Kim, Y. J.; Baik, S. Functionalized nano-silver particles assembled on one-dimensional nanotube scaffolds for ultra-highly conductive silver/polymer composites. J. Mater. Chem. 2010, 20, 3579.
    • (2010) J. Mater. Chem. , vol.20 , pp. 3579
    • Oh, Y.1    Chun, K.Y.2    Lee, E.3    Kim, Y.J.4    Baik, S.5
  • 18
    • 33846471835 scopus 로고    scopus 로고
    • Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes
    • Wu, H. P.; Wu, X. J.; Ge, M. Y.; Zhang, G. Q.; Wang, Y. W.; Jiang, J. Z. Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes. Composites Sci. Technol. 2007, 67, 1182.
    • (2007) Composites Sci. Technol. , vol.67 , pp. 1182
    • Wu, H.P.1    Wu, X.J.2    Ge, M.Y.3    Zhang, G.Q.4    Wang, Y.W.5    Jiang, J.Z.6
  • 19
    • 29444434458 scopus 로고    scopus 로고
    • Reliability improvement of conductive adhesives on tin (Sn) surfaces
    • Li, Y.; Moon, K. S.; Wong, C. P. Reliability improvement of conductive adhesives on tin (Sn) surfaces. J. Adhes. Sci. Technol. 2005, 19, 1427.
    • (2005) J. Adhes. Sci. Technol. , vol.19 , pp. 1427
    • Li, Y.1    Moon, K.S.2    Wong, C.P.3
  • 20
    • 0011788682 scopus 로고    scopus 로고
    • Novel conductive adhesives for surface mount applications
    • Lu, D. Q.; Wong, C. P. Novel conductive adhesives for surface mount applications. J. Appl. Polym. Sci. 1999, 74, 399.
    • (1999) J. Appl. Polym. Sci. , vol.74 , pp. 399
    • Lu, D.Q.1    Wong, C.P.2
  • 21
    • 10044241648 scopus 로고    scopus 로고
    • Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials
    • Moon, K. S.; Liong, S.; Li, H. Y.; Wong, C. P. Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials. J. Electron. Mater. 2004, 33, 1381.
    • (2004) J. Electron. Mater. , vol.33 , pp. 1381
    • Moon, K.S.1    Liong, S.2    Li, H.Y.3    Wong, C.P.4
  • 22
    • 1542276523 scopus 로고    scopus 로고
    • A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces
    • Li, H. Y.; Moon, K. S.; Wong, C. P. A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces. J. Electron. Mater. 2004, 33, 106.
    • (2004) J. Electron. Mater. , vol.33 , pp. 106
    • Li, H.Y.1    Moon, K.S.2    Wong, C.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.