Deposition of copper oxide by reactive magnetron sputtering

Metals and Materials International

Volumn 17, Issue 6, 2011, Pages 917-921

  Lee, J H ^a   Jeong, K H ^a   Cho, W H ^b   Ho, W J ^b   Yang, H J ^b   Kim, C S ^c   Lee, J G ^a  

^a Kookmin University   (South Korea)

^b LG Display Co Ltd   (South Korea)

^c Korea Research Institute of Standards and Science   (South Korea)

Author keywords

Oxidation; Oxides; Reactive sputtering; Sputtering; X ray diffraction

Indexed keywords

EID: 84863039282     PISSN: 15989623     EISSN: 20054149     Source Type: Journal    
DOI: 10.1007/s12540-011-6008-6     Document Type: Article

References (29)

1. J. Herion, Appl. Phys. Lett. 34 ,599 (1979).
2. S. Ishizuka, K. Suzuki, Y. Okamoto, M. Yanagita, T. sakurai, K. Akimoto, N. Fujiwara, H. Kobayashi, K. Matsubara, and S. NiKi, Phys. Satus Solidi (c) 1, 1067 (2004).
3. T. Minami, H. Tanaka, T. Shimakawa, T. Miyata, and H. Sato, Jpn. J. Appl. Phys. 43, 917 (2004).
4. T. J. Richardson, J. L Slack, and M. D. Rubin, Electrochiminica. Acta 46, 2281 (2001).
5. J. W. Park, K. J. Baeg, J. Ghim, S. J. Hang, J. H. Park, and D.Y. Kim, Electrochem. Solid-State Lett. 10, H340 (2007).
6. J. Ramirez-Ortiz, T. Ogura, J. Medina-Valtierra, Sofia E. Acosta-Ortiz, P. Bosch, J. Antonio de los Reyes, and V. H. Lara, Appl. Surf. Sci. 174, 177 (2001).
7. B. Balamurugan, and B. R. Metha, Thin Solid Film 396, 90 (2001).
8. S. Ishizuka, T. Maruyama, and K. Akimoto, Jpn. J. Appl. Phys. 37, L786 (2000).
9. Z. G. Yin, H. T. Zhang, D. M. Goodner, M. J. Bedzyk, R. P. H. Chang, Y. Sun, and J. B. Ketterson, Appl. Phys. Lett. 86, 061901 (2005).
10. S. E. K. Kim and M. Oliver, Met. Mater. Int. 16, 441 (2010).
11. M. A. Rahman, H. J. Park, A. R. Kim, C. Y. Lee, and J. G. Lee, Electron. Mater. Lett. 6, 209 (2010).
12. A. O. Musa, J. Akometafe, and M. J. Carter, Sol. Energy Mater. Sol. Cells. 51, 305 (1998).
13. H. Matsumura, A. Fujii, and T. Kitatani, Jpn. J. Appl. Phys. 35, 5631 (1996).
14. T. Kosugi, and S. Kaneko, J. Am. Ceram. Soc. 81, [12] 3117 (1998).
15. J. Morales, L. Sanchez, F. Martin, J.R. Ramos-Barrado, and M. Sanchez, Electrochimica Acta 49, 4589 (2004).
16. T. Mahalingam, J. S. P. Chitra, J. P. Chu, S. Velumani, and P. J. Sebastian., Sol. Energy Mater. Sol. Cells. 88, 209 (2005).
17. J. Morales, L. Sanchez, S. Bijani, L. Martinez, M. Gabas, and J. R. Ramos-Barrado, Electrochem. Solid-State Lett. 8, A159 (2005).
18. Y. L. Liu, Y. C. Liu, R. Mu, H. Yang, C. L. Shao, J. Y. Zhang, Y. M. Lu, D. Z. Shen, and X. W. Fan, Semicond. Sci. Technol. 20, 44 (2005).
19. William D. Westwood, Sputter Deposition, p. 218 AVS, New York, (2003).
20. F. Perry, A. Billard, and C. Frantz, Surf. Coat. Technol. 94- 95, 681 (1997).
21. J. Affinito and R. R. Parsons, J. Vac. Sci. Technol. A 2, 1275 (1984).
22. B. Szapiro and J. J. Rocca, J. Appl. Phys. 65, 3713 (1989).
23. D. N. Popov and P. I. Docheva, Vacuum. 42, 53 (1991).
24. John F. O'Hanlon, A User's Guide to Vacuum Technology, p.195, Wiley, New York (1980).
25. Michael A. Lieberman, and Allan J. Lichtenberg, Principles of Plasma Discharges and Materials Processing, p.255 Wiley, New York (1994).
26. Brian Chapman, Glow Discharge Processes: Sputtering and Plasma Etching, p. 90, Wiley, New York (1980).
27. S. Berg, H.-O. Blom, T. Larsson, and C. Nender, J. Vac. Sci. Technol. A 5, 202 (1987).
28. J. C. Lin, G. Chen, and C. Lee, J. Electrochem. Soc. 146, 1835 (1999).
29. A. Hecq, M. Vandy, and M. Hecq, J. Chem. Phys. 72, 2876 (1980).