Microfabrication of SiN membrane nanosieve using anisotropic reactive ion etching (ARIE) with an Ar/CF 4 gas flow

Journal of Nanoscience and Nanotechnology

Volumn 11, Issue 5, 2011, Pages 4511-4516

  Lee, Dae Sik ^a   Song, Hyun Woo ^a   Chung, Kwang Hyo ^a   Jung, Mun Yeon ^a   Yoon, Hyun C ^b  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Ajou University   (South Korea)

Author keywords

Anisotropic etch; Nanomachining; Nanosieve; SiN membrane

Indexed keywords

ANISOTROPIC ETCH; ANISOTROPIC REACTIVE ION ETCHING; CMOS IC; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; E-BEAM RESIST; ELECTRON BEAM WRITING; ETCH HOLE; HIGH TEMPERATURE; HYDROGEN CHLORIDE; HYDROGEN FLUORIDE; NANOMACHINING; NANOSIEVE; TRANSMEMBRANE PRESSURES;

ANISOTROPY; CHLORINE COMPOUNDS; ELECTRON BEAMS; NITRIC ACID; POTASSIUM HYDROXIDE; REACTIVE ION ETCHING; SILICON NITRIDE;

MEMBRANES;

EID: 84863012798     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2011.3631     Document Type: Conference Paper

References (22)

1. C. C. Striemer, T. R. Gaborski, J. L. McGrath, and P. M. Fauchet, Nature 445, 749(2007).
2. A. Yamaguchi, F. Uejo, T. Yoda, T. Uchida, Y. Tanamura, T. Yamashita, and N. Teramae, Nature Mater. 3, 337(2004).
3. C. Jiang, S. Markutsya, Y. Pikus, and V. V. Tsukruk, Nature Mater. 3, 721(2004).
4. L. Vicente, M. Carmen, M. Francisco, Z. Felix, and E. Eduardo, J. Nanosci. Nanotechnol. 9, 6396(2009).
5. N. Libo, G. Huishi, H. Quanguo, C. Jianrong, and M. Yuqing, J. Nanosci. Nanotechnol. 7, 560(2007).
6. H. D. Tong, H. V. Jansen, V. J. Gadgil, C. G. Bostan, E. Berenschot, C. J. M. Rijn, and M. Elwenspoek, Nano Lett. 4, 283(2004).
7. T. Albert, S. Neus, C. Andrea, G. Isabel, R. Jaume, G. Inigo, E. Juan P, G. Gemma, C. Carles, and S. Jose, J. Nanosci. Nanotechnol. 10, 1327(2010).
8. G. Stemme and G. Kittilsland, Appl. Phys. Lett. A 53, 1566(1988).
9. S. Kuiper, C. J. M. Rijn, W. Nijdam, and M. C. Elwenspoek, J. Membr. Sci. 150, 1(1998).
10. J. Chen, M. A. Reed, A. M. Rawlett, and J. M. Tour, Science 286, 1550(1999).
11. J. Li, D. Stein, C. McMullan, D. Branton, M. J. Azis, and J. A. Golovchenko, Nature 412, 166(2001).
12. C. Schmidt, M. Mayer, and H. Vogel, Angew. Chem., Int. Ed. 39, 3137(2000).
13. J. Min, Biochip J. 1, 90(2007).
14. A. J. Storm, J. H. Chen, X. S. Ling, H. W. Zandbergen, and C. Dekker, Nature Mater. 2, 537(2003).
15. G. T. A. Kovacs, Micromachined Transducers, McGraw-Hill, New York, USA (1998), p. 65.
16. X. Yang, J. M. Yang, Y. C. Tai, and C. M. Ho, Sens. Actuators 73, 184(1999).
17. J. P. Pallas, R. D. Boyd, J. A. Britten, A. Fernandex, A. M. Hawryluk, M. D. Perry, and D. R. Kania, J. Vac. Sci. Technol. B 14, 2005(1996).
18. G. T. A. Kovacs, Micromachined Transducers, McGraw-Hill, New York, USA (1998), p. 79.
19. C. J. M. van Rijn, M. Van der Wekken, W. Nijdam, and M. C. Elwenspek, J. Microelectromech. S. 6, 48(1977).
20. G. T. A. Kovacs, Micromachined Transducers, McGraw-Hill, New York, USA (1998), p. 90.
21. H. G. Choi, J. H. Lee, H. C. Yoon, and D. S. Lee, Biochip J. 1, 253(2007).
22. D. S. Lee, Y. B. Shin, Y. H. Choi, M. Y. Jung, and H. C. Yoon, Biochip J. 3, 230(2009).