Studies on microstructure of Epoxy Molding Compound (EMC)-leadframe interface after environmental aging

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 1051-1053

  Xiuzhen, Lu ^a   Li, Xu ^a   Huaxiang, Lai ^a   Xinyu, Du ^b   Johan, Liu ^a,c   Zhaonian, Cheng ^a  

^a SHANGHAI UNIVERSITY   (China)

^b HENKEL CORPORATION   (United States)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION STRENGTHS; AFTER-TREATMENT; COATING INTERFACES; ELECTRONIC PACKAGING; ENVIRONMENTAL AGING; EPOXY MOLDING COMPOUNDS; INTERFACE MICROSTRUCTURES; LEAD-FRAME; METAL COATINGS; NI COATING; PULL TESTING; RELIABILITY TEST; SEM; SEM MICROGRAPHS;

ADHESION; BOND STRENGTH (MATERIALS); DELAMINATION; ELECTROMAGNETIC COMPATIBILITY; ELECTRONICS PACKAGING; FAILURE ANALYSIS; METALLIC FILMS; METALS; MICROSTRUCTURE; MOLDING; PACKAGING; PLASTIC MOLDS; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY; SHEET MOLDING COMPOUNDS; SILVER; STEEL SHEET;

OPTICAL DEVICES;

EID: 70450219463     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270584     Document Type: Conference Paper

References (7)

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7. Rainer Dudek, et al., "Numercal Analysis for Thermomechanical reliability of polymers in electronic packaging," IEEE Polytronic 2007 Conference, Tokyo, Japan, January, 2007, pp. 220-227.