High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 290-294

  Variyam, M ^b   Sundararaman, V ^b   Sitaraman, Suresh K ^b   Wu, Jiali ^b   Pike, R T ^b   Wong, C P ^a,b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINA; COPPER; DIELECTRIC MATERIALS; ELECTRIC CONTACTS; SEMICONDUCTING SILICON; THIN FILM CIRCUITS;

ADHESIVE ATTACH; PALLETIZATION METHOD;

ELECTRONICS PACKAGING;

EID: 0033352432     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.816096     Document Type: Article

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