Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 1039-1042

  Li, Xu ^a   Xiuzhen, Lu ^a   Johan, Liu ^a,c   Xinyu, Du ^b   Yan, Zhang ^a   Zhaonian, Cheng ^c  

^a SHANGHAI UNIVERSITY   (China)

^b HENKEL CORPORATION   (United States)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION BEHAVIORS; ADHESION STRENGTHS; C-MODE SCANNING ACOUSTIC MICROSCOPE; ELECTRONIC PACKAGING; EPOXY MOLDING COMPOUNDS; FAILURE PROBLEMS; INTERFACE ADHESION; KEY ELEMENTS; LEAD FRAME; METAL-COATED; MOISTURE ABSORPTION; PACKAGE PERFORMANCE; PLASTIC PACKAGES; PLASTIC PACKAGING; REFLOW PROCESS; SEM; VERTICAL PLANE;

ACOUSTIC MICROSCOPES; ADHESION; BOND STRENGTH (MATERIALS); COPPER; ELECTROMAGNETIC COMPATIBILITY; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; INORGANIC COATINGS; MOLDING; OPTICAL DEVICES; PLASTIC COATINGS; PLASTIC MOLDS; SCANNING ELECTRON MICROSCOPY; SHEET MOLDING COMPOUNDS; SILVER; STEEL SHEET;

PACKAGING;

EID: 70449916582     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270581     Document Type: Conference Paper

References (7)

1. H. B. Fan, et al., "A new method to Predict delamination in electronic packages," Electronic Components and Technology Conference, 2005, pp. 145-150.
2. Lara J. Martin, et al., "Chemical and mechanical adhesion mechanisms of sputter-deposited metal on epoxy dielectric for high density interconnect printed circuit boards," IEEE, 2000, pp.416-424.
3. Cell K. Y. Wong, Hongwei Gu, Bing Xu, and Matthew M.F. Yuen, "A New Approach in Measuring Cu-EMC Adhesion Strength by AFM," Components and Packaging Technologies, VOL.29, No.3, September 2006, pp. 543-550.
4. M. Lebbai, et al., "Effect of black oxide on interface adhesion between copper substrate & glob-top resin," IEEE, 2000, pp. 61-69.
5. Jang-Kyo KIM, et al., "Interface adhesion between copper leadframe and epoxy moulding compound: effect of surface finish, oxidation and dimples," Electronic Components and Technology Conference, 2000, pp. 601-608.
6. Xinyu Du, Guangchao Xie, Wei Tan, Suqiong Qin and Xingming Cheng, "Stress Reduction of Epoxy Molding Compound and Its Effect on Delamination", Proceedings of HDP'07, 2007, pp. 50-54.
7. Teck-Gyu. Kang, Ik-Seong Park et al., "Characterization of Oxidized Copper Leadframes and Copper/Epoxy Molding Compound Interface Adhesion in Plastic Package," IEEE, 1998, pp. 106-111.