Chemical mechanical polishing of stainless steel foil as flexible substrate

Applied Surface Science

Volumn 258, Issue 15, 2012, Pages 5798-5802

  Hu, Xiaokai ^a   Song, Zhitang ^a   Liu, Weili ^a   Qin, Fei ^a   Zhang, Zefang ^a   Wang, Haibo ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Chemical mechanical polish; Colloidal silica; Electrochemical corrosion; Flexible substrate; Stainless steel

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROCHEMICAL CORROSION; FLEXIBLE DISPLAYS; GEOMETRICAL OPTICS; POLISHING; SCANNING ELECTRON MICROSCOPY; SILICA; STAINLESS STEEL; STEEL CORROSION; SURFACE DEFECTS; SURFACE ROUGHNESS; THIN FILM TRANSISTORS;

CHEMICAL MECHANICAL POLISHING(CMP); COLLOIDAL SILICA; FLEXIBLE SUBSTRATE; FLEXIBLE THIN FILMS; MATERIAL REMOVAL RATE; MICROSCOPIC DEFECTS; POLISHED SURFACES; STAINLESS STEEL FOIL;

CHEMICAL MECHANICAL POLISHING;

EID: 84862797091     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.02.100     Document Type: Article

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