Cross-section preparation for solder joints and MEMS device using argon ion beam milling

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 265-271

  Amirmajdi, Omid Mokhtari ^a   Ashyer Soltani, Roya ^a   Clode, Michael Paul ^a   Mannan, Samjid H ^a   Wang, Yunqi ^b   Cabruja, Enric ^c   Pellegrini, Giulio ^c  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

Cross section polisher; Lead free; Sn Ag Cu; Solder

Indexed keywords

ARGON ION BEAM; CHEMICAL ETCHING; COPPER SUBSTRATES; CROSS SECTION; CROSS-SECTION POLISHER; EUTECTIC SOLDERS; FLAT SURFACES; INTERMETALLIC COMPOUNDS; INTERNAL STRUCTURE; ION BEAM METHOD; ION BEAM MILLING; LEAD-FREE; MECHANICAL POLISHING; MEMSDEVICES; NICKEL SUBSTRATES; SAC-SOLDERS; SEM; SIMULTANEOUS OBSERVATION; SN-AG-CU; SOLDER; SOLDER JOINT MICROSTRUCTURE; SOLDER JOINTS; SUBSTRATE CRYSTALS; TYPE STRUCTURES;

ARGON; BEAM PLASMA INTERACTIONS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; ION BEAMS; ION BOMBARDMENT; IONS; LEAD; MEMS; MICROELECTROMECHANICAL DEVICES; MILLING (MACHINING); NIOBIUM; POLISHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

TIN;

EID: 70350340323     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2029344     Document Type: Article

References (13)

1. H. Takahashi et al., "A new method of surface preparation for high spatial resolution EPMA/SEM with an argon ion beam," Microchimica Acta, vol. 155, no. 1-2, pp. 295-300, 2006.
2. N. Erdman, R. Campbell, and S. Asahina, "Precise SEM cross section polishing via argon beam milling," Microscopy Today, vol. 14, no. 3, pp. 22-25, 2006.
3. K. Ogura et al., "New methods for cross-section sample preparation using broad argon ion beam," Microsc Microanal, 2007.
4. I. E. Anderson, "Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications,," J. Mater. Sci.-Mater. Electron., vol. 18, no. 1-3, pp. 55-76, 2007.
5. J. Y. Park et al., "Influence of au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy," in Proc. Annu. Meeting Minerals-Metals-and-Materials-Soc., San Diego, CA, 2003, TMS.
6. A. A. Tseng, "Recent developments in nanofabrication using focused ion beams," Small, vol. 1, no. 10, pp. 924-939, 2005.
7. J. F. Li et al., "Failure mechanisms of dummy IGBT assembles constructed using liquid In-Sn/Nb system," in Proc. 9th Electron. Packag. Technol. Conf., Singapore, 2007.
8. G. Pellegrin et al., "Fabrication and simulation of Novel Ultra Thin 3D silicon detector-Plasma diagnostics for JET and ITER TOKAMAKS," in Proc. 8th Int. Conf. Position Sensitive Detectors, PSD8, Glasgow, U.K., 2008.
9. H. Hao et al., "Properties of Sn3.8AgO.7Cu solder alloy with trace rare earth element Y additions," J. Electron. Mater., vol. 36, no. 7, pp. 766-774, 2007.
10. C. Andersson et al., "Thermal cycling aging effect on the shear strength, microstructure, intermetallic compounds (IMC) and crack initiation and propagation of reflow soldered Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components," IEEE Trans. Compon. Packag. Technol., vol. 31, no. 2, pp. 331-344, Jun. 2008.
11. M. F. Arenas, M. He, and V. L. Acoff, "Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates," J. Electron. Mater., vol. 35, no. 7, pp. 1530-1536, 2006.
12. N. Dariavach et al., "Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrate," J. Electron. Mater., vol. 35, no. 7, pp. 1581-1592, 2006.
13. J. F. Li et al., "Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects," Acta Mater., vol. 54, no. 11, pp. 2907-2922, 2006.