Grain boundary relaxation strengthening of nanocrystalline Ni-W alloys

Journal of Materials Research

Volumn 27, Issue 9, 2012, Pages 1285-1294

  Rupert, Timothy J ^a,b   Trelewicz, Jason R ^a   Schuh, Christopher A ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b University of California at Irvine   (United States)

Author keywords

Grain boundaries; Hardness; Nanostructure

Indexed keywords

ACTIVATION VOLUME; ANNEALING TEMPERATURES; DOMINANT DEFORMATION MECHANISM; GRAIN BOUNDARY RELAXATION; GRAIN SIZE; GRAIN-BOUNDARY DEFECTS; HALL-PETCH; HARDENING EFFECTS; KINETIC RATES; NANOCRYSTALLINES; NI-W ALLOY; NON-EQUILIBRIUM GRAIN BOUNDARIES; TEMPERATURE DEPENDENCE; TRIPLE JUNCTION;

ANNEALING; GRAIN SIZE AND SHAPE; HARDENING; HARDNESS; KINETICS; NANOSTRUCTURES; TUNGSTEN ALLOYS;

GRAIN BOUNDARIES;

EID: 84862005632     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2012.55     Document Type: Article

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