Experimental observations of stress-driven grain boundary migration

Science

Volumn 326, Issue 5960, 2009, Pages 1686-1690

  Rupert, T J ^a,b   Gianola, D S ^a,c   Gan, Y ^d   Hemker, K J ^a  

^a Johns Hopkins University   (United States)

^b Massachusetts Institute of Technology Cambridge   (United States)

^c UNIVERSITY OF PENNSYLVANIA   (United States)

^d KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; NANOCRYSTAL;

CRYSTAL CHEMISTRY; CRYSTAL STRUCTURE; EXPERIMENTAL STUDY; GRAIN BOUNDARY; MOLECULAR ANALYSIS; PLASTIC DEFORMATION; SHEAR STRESS;

ARTICLE; EXPERIMENTAL STUDY; FILM; GRAIN; MOLECULAR DYNAMICS; MOTION; PLASTICITY; PRIORITY JOURNAL; SHEAR STRESS; SIMULATION;

EID: 72949087096     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1178226     Document Type: Article

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36. This work was supported by the U.S. Department of Energy, Office of Basic Energy Science and the NSF Nanoscale Interdisciplinary Research Team program (grant no. DMR-0210215). The authors are grateful for illuminating discussions with J. D. Embury and C. Eberl regarding the development of complex stress states in patterned thin films. D.S.G. acknowledges support from an Alexander von Humboldt postdoctoral fellowship.