Enhanced solid solution effects on the strength of nanocrystalline alloys

Acta Materialia

Volumn 59, Issue 4, 2011, Pages 1619-1631

  Rupert, Timothy J ^a   Trenkle, Jonathan C ^a   Schuh, Christopher A ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Mechanical behavior; Nanocrystalline metals; Nanoindentation; Solute strengthening; Thin films

Indexed keywords

COMPOSITION RANGES; DISLOCATION MOTION; DISLOCATION PINNING; GLOBAL EFFECTS; GRAIN SIZE; MECHANICAL BEHAVIOR; MECHANISTIC MODELS; MODEL SYSTEM; NANO-CRYSTALLINE STRUCTURES; NANOCRYSTALLINE METALS; NANOCRYSTALLINE SYSTEMS; PINNING POINTS; SOLID SOLUTION STRENGTHENING; SOLID-SOLUTION SOFTENING; SOLUTE ATOMS; SOLUTE CONTENT; SOLUTE STRENGTHENING; SOLUTION EFFECTS; SPUTTERED ALLOYS;

CERIUM ALLOYS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL ENGINEERING; NANOCRYSTALLINE MATERIALS; NANOINDENTATION; SOLID SOLUTIONS; SOLIDIFICATION; STRENGTHENING (METAL); THIN FILMS;

NANOCRYSTALLINE ALLOYS;

EID: 78651385043     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.11.026     Document Type: Article

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