Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 688-695

  Kwon, Woon Seong ^a   Yang, Se Young ^a   Lee, Soon Bok ^b   Paik, Kyung Wook ^b  

^a SAMSUNG Electronics   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive films (ACFs); Contraction stress; Phase shifting moir interferomtry; Shrinkage; Thermomechanical analysis

Indexed keywords

ANISOTROPY; DEFORMATION; DYNAMIC MECHANICAL ANALYSIS; INTERFEROMETRY; MECHANICAL PROPERTIES; STRESSES; THERMODYNAMIC PROPERTIES;

ANISOTROPIC CONDUCTIVE FILMS (ACFS); CONTRACTION STRESS; FLIP CHIP INTERCONNECTION; PHASE SHIFTING MOIRE INTERFEROMETRY; THERMOMECHANICAL ANALYSIS;

CONDUCTIVE FILMS;

EID: 33748623842     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.881763     Document Type: Article

References (13)

1. J. Liu, "An overview of advances of conductive adhesive joining technology in electronics applications," Mater. Technol., vol. 10, pp. 247-252, 1995.
2. M. J. Yim, K. W. Paik, Y. K. Kim, and H. N. Hwang, "A study on the electrical conduction mechanism of anisotropically conductive film for LCD packaging application," in Advances in Electronic Packaging. New York: EEP, 1997, vol. 19-1, pp. 65-72.
3. Y. Fu, Y. Wang, X. Wang, J. Liu, and Z. Lai, "Experimental characterization and theoretical characterization of electrical contact in anisotropically conductive adhesives," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 23, no. 1, pp. 15-21, Feb. 2000.
4. Z. Lai and J. Liu, "Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 19, no. 3, pp. 644-660, Aug. 1996.
5. A. R. Plepys and R. J. Farris, "Evolution of residual stresses in three-dimensionally constrained epoxy resins," Polymer, vol. 31, pp. 1932-1936, 1990.
6. M. Ochi, K. Yamashita, and M. Shimbo, "The mechanism for occurrence of unternal stress during curing epoxide resins," J. Appl. Polym. Sci., vol. 43, pp. 2013-2019, 1991.
7. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré. New York: Springer Verlag, 1994.
8. B. Han, Y. Guo, C. K. Lim, and D. Caletka, "Verification of numerical models used in microelectronics packaging design by interferometric displacement measurement methods," ASME Trans. J. Electron. Packag., vol. 118, pp. 157-163, 1996.
9. J. Pyland, R. V. Pucha, and S. K. Sitaraman, "Thermomechanical reliability of underfilled BGA packages," IEEE Trans. Electron. Packag. Manufact., vol. 25, no. 2, pp. 100-106, Apr. 2002.
10. P. Carré, "Installation et utilization du comparateur photoelectrique et interferentiel du Bureau International des Poids et Mesures," Metrologia, vol. 2, pp. 13-23, 1966.
11. B. Han, "Higher sensitivity moiré interferometry for micromechanics studies," Opt. Eng.: J. Soc. Photo-opt. Instrum. Eng., vol. 31-7, pp. 1517-1526, 1992.
12. D. Zou, X. He, S. Liu, Y. Guo, and F. Dai, "Resolving deformation field near corners and interfaces by phase shifting moiré interferometry," Appl. Exper. Mech. Electron. Packag., vol. 22, pp. 69-76, 1997.
13. X. He, D. Zou, and S. Liu, "Phase-shifting analysis in moiré interferometry and its applications in electronic packaging," Opt. Eng.: J. Soc. Photo-opt. Instrum. Eng., vol. 37, no. 5, pp. 1410-1419, 1998.