Novel packaging technology for body sensor networks based on adhesive bonding: A low cost, mass producible and high reliability solution

2010 International Conference on Body Sensor Networks, BSN 2010

Volumn , Issue , 2010, Pages 308-314

  Linz, Torsten ^a   Von Krshiwoblozki, Malte ^a   Walter, Hans ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Component; Electrical contacts; Electronics in textiles; Non conductive adhesive; Reliability; Wearable electronics

Indexed keywords

COMPONENT; ELECTRICAL CONTACTS; ELECTRONICS IN TEXTILES; NON-CONDUCTIVE ADHESIVES; WEARABLE ELECTRONICS;

BIOLOGICAL MEMBRANES; ELECTRIC CONTACTS; FABRICS; RELIABILITY; SENSOR NETWORKS;

TECHNOLOGY;

EID: 77955184740     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/BSN.2010.56     Document Type: Conference Paper

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