메뉴 건너뛰기




Volumn , Issue , 2012, Pages 305-308

Poly-SiGe-based CMUT array with high acoustical pressure

Author keywords

[No Author keywords available]

Indexed keywords

3-D ULTRASOUND; AC VOLTAGE; ACOUSTICAL PRESSURE; CAPACITIVE MICROMACHINED ULTRASOUND TRANSDUCER; CMOS COMPATIBLE; DIELECTRIC LAYER; ELECTRICAL FIELD; HIGH-DENSITY INTEGRATION; INTEGRATED ELECTRONICS; POLY-SIGE; POLYCRYSTALLINE SILICON GERMANIUMS; PULSE ECHOES;

EID: 84860491073     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2012.6170155     Document Type: Conference Paper
Times cited : (14)

References (10)
  • 2
    • 0035731025 scopus 로고    scopus 로고
    • A Cost-effective and Manufacturable Route to the Fabrication of High-Density 2D Micromachined Ultrasonic Transducer Array and (CMOS) Signal Conditioning Electronics on the same Silicon Substrate
    • R.Noble et al, "A Cost-effective and Manufacturable Route to the Fabrication of High-Density 2D Micromachined Ultrasonic Transducer Array and (CMOS) Signal Conditioning Electronics on the same Silicon Substrate" IEEE International Ultrasonics Symposium Proceedings, pp. 941-945, 2001.
    • (2001) IEEE International Ultrasonics Symposium Proceedings , pp. 941-945
    • Noble, R.1
  • 3
    • 21644470582 scopus 로고    scopus 로고
    • Microfabricated Ultrasonic Transducer Monolithocally Integrated with High Voltage Electronics
    • C.Daft et al, "Microfabricated Ultrasonic Transducer Monolithocally Integrated with High Voltage Electronics", IEEE International Ultrasonics Symposium Proceedings, pp493-496, 2004.
    • (2004) IEEE International Ultrasonics Symposium Proceedings , pp. 493-496
    • Daft, C.1
  • 4
    • 40549140813 scopus 로고    scopus 로고
    • Integration of 2D CMUT Array with Front-End Electronics for Volumetric Ultrasound Imaging
    • I.Wygant et al, "Integration of 2D CMUT Array with Front-End Electronics for Volumetric Ultrasound Imaging" IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, Vol.55 No 2, pp. 327-342, 2008.
    • (2008) IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control , vol.55 , Issue.2 , pp. 327-342
    • Wygant, I.1
  • 5
    • 67649335392 scopus 로고    scopus 로고
    • Single Chip: CMUT Arrays with Integrated CMOS Electronics: Fabrication Process Development and Experimental Results
    • J.Zahorian et al, "Single Chip: CMUT Arrays with Integrated CMOS Electronics: Fabrication Process Development and Experimental Results" IEEE International Ultrasonics Symposium Proceedings, pp. 386-389, 2008.
    • (2008) IEEE International Ultrasonics Symposium Proceedings , pp. 386-389
    • Zahorian, J.1
  • 6
    • 0344088287 scopus 로고    scopus 로고
    • Polycrystalline Silicon-Germanium Films for Integrated Microsystems
    • A.Franke et al, "Polycrystalline Silicon-Germanium Films for Integrated Microsystems", IEEE/ASME J. Microelectromechanical Systems, vol.12(2), pp 160-171, 2003.
    • (2003) IEEE/ASME J. Microelectromechanical Systems , vol.12 , Issue.2 , pp. 160-171
    • Franke, A.1
  • 8
    • 80052132374 scopus 로고    scopus 로고
    • Highly Reliable CMOS-Integrated 11 Mpixel SiGe-based Micro-Mirror Arrays for High-End Industrial Applications
    • L.Haspeslagh et al, "Highly Reliable CMOS-Integrated 11 Mpixel SiGe-based Micro-Mirror Arrays for High-End Industrial Applications" Digest Tech. Papers IEDM08 Conference San Fransisco, USA, Dec 15-17, pp 1-4, 2010.
    • (2010) Digest Tech. Papers IEDM08 Conference San Fransisco, USA, Dec 15-17 , pp. 1-4
    • Haspeslagh, L.1
  • 10
    • 0012636808 scopus 로고    scopus 로고
    • Delay-Masking Process for Silicon Three-Dimensional Bulk Structures
    • May
    • M.Mita, "Delay-Masking Process for Silicon Three-Dimensional Bulk Structures", Trans. IEEJ, Vol.119-E, pp 493-497, May, 1999.
    • (1999) Trans. IEEJ , vol.119 E , pp. 493-497
    • Mita, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.