Quantifying the effect of porosity on the evolution of deformation and damage in Sn-based solder joints by X-ray microtomography and microstructure-based finite element modeling

Acta Materialia

Volumn 60, Issue 9, 2012, Pages 4017-4026

  Padilla, E ^a   Jakkali, V ^a   Jiang, L ^a   Chawla, N ^a  

^a AZ 85281   (United States)

Author keywords

3 D materials science; Finite element method; Pb free solder; Porosity

Indexed keywords

CRACK NUCLEATION; DUCTILE DAMAGE MODELS; EXACT GEOMETRY; EXPERIMENTAL OBSERVATION; FE-SIMULATION; FINITE ELEMENT MODELING; FINITE ELEMENT MODELS; MECHANICAL PERFORMANCE; PB FREE SOLDERS; PROPAGATION PATHS; SHEAR TESTS; SINGLE LAP SHEARS; SN-BASED SOLDERS; THREE-DIMENSIONAL MODEL; X RAY MICROTOMOGRAPHY;

DEFORMATION; FINITE ELEMENT METHOD; LEAD; MICROSTRUCTURE; POROSITY; SOLDERING ALLOYS; TIN;

THREE DIMENSIONAL;

EID: 84860386307     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.03.048     Document Type: Article

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