Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 9, 2011, Pages 1350-1358

  Liu, He ^a   Salomonsen, Guttorm ^a   Wang, Kaiying ^a   Aasmundtveit, Knut E ^a   Hoivik, Nils ^a  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

Author keywords

Electrochemical process; interconnections; resistance measurement; wafer bonding

Indexed keywords

BONDING PROCESS; DYNAMIC WETTING; ELECTROCHEMICAL PROCESS; INTERCONNECTIONS; MICROSCOPIC TECHNIQUES; RESISTANCE MEASUREMENT; SOLID-LIQUID; WAFER LEVEL;

ELECTRONICS PACKAGING; LIQUIDS; TIN;

WAFER BONDING;

EID: 84859805387     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2156793     Document Type: Article

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