Characterization of oxidation of electroplated Sn for advanced flip-chip bonding

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Zhang, W ^a   Ruythooren, W ^a  

^a IMEC   (Belgium)

Author keywords

Electroplated Sn; Flip chip; Oxidation; Oxide removal

Indexed keywords

ELECTROPLATED SN; FLIP CHIP; FLIP-CHIP BONDING; FLUX-LESS SOLDERING; OXIDE REMOVAL; OXIDE THICKNESS; PB FREE SOLDERS; ROOM TEMPERATURE; TEMPERATURE RAMP; XPS;

CHIP SCALE PACKAGES; ELECTROPLATING; FLIP CHIP DEVICES; LEAD; MICROELECTRONICS; OXIDATION; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 70449920920     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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