Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

Journal of Instrumentation

Volumn 4, Issue 3, 2009, Pages

  Huffman, Alan ^a   Lannon, John ^a   Lueck, Matthew ^a   Gregory, Christopher ^a   Temple, Dorota ^a  

^a RTI INTERNATIONAL   (United States)

Author keywords

Hybrid detectors; Solid state detectors

Indexed keywords

FABRICATION AND CHARACTERIZATIONS; HYBRID DETECTORS; INTERCONNECT STRUCTURES; MECHANICAL AND ELECTRICAL; MECHANICAL PERFORMANCE; SOLID STATE DETECTORS; SOLID-LIQUID DIFFUSION BONDINGS; THERMO COMPRESSION BONDING;

ELECTRIC CONNECTORS; ENERGY DISPERSIVE SPECTROSCOPY; PIXELS; SEMICONDUCTOR DETECTORS;

METALS;

EID: 70549089972     PISSN: 17480221     EISSN: 17480221     Source Type: Journal    
DOI: 10.1088/1748-0221/4/03/P03006     Document Type: Article

References (6)

1. K. Tanida et al. 2004 Micro Cu bump interconnection on 3D chip stacking technology, Jap. J. Appl. Phys. 43(4B) 2264
2. H. Huebner et al. 2002 Face-to-face chip integration with full metal interface, in the proceedings of the Advanced Metallization Conference 2002, October 1-3, San Diego, CA U.S.A. and October 29-30, Tokyo, Japan
3. A. Huffman et al. 2007 Effects of assembly process parameters on the structure and thermal stability of Sn-capped Cu bump bonds, in the proceedings of the 47th Electronic Components and Technology Conference, May 18-21, San Jose, CA U.S.A.
4. N. Koopman and S. Nangalia 1995 Fluxless flip chip solder joining, in the proceedings of the NEPCON West '95, February 28-March 2, Anaheim, CA U.S.A.
5. R.J. Fields and S.R. Low 2001 Physical and mechanical properties of intermetallic compounds commonly found in solder joints, NIST Research Publication
6. K. Tanida et al 2003 Ultra-high-density 3D chip stacking technology, in the proceedings of the 43th Electronic Components and Technology Conference, May 27-30, New Orleans, LA U.S.A.