A numerical method for efficient failure modelling of three-dimensional bond pad structures

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 235-241

  Van Der Sluis, O ^a,b   Van Silfhout, R B R ^a   Engelen, R A B ^a   Van Driel, W D ^b,c   Zhang, G Q ^b,c   Ernst, L J ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENERGY RELEASE RATE; NUMERICAL METHODS; RELIABILITY ANALYSIS;

MICROELECTRONIC COMPONENTS; MINIATURIZATION; THERMOMECHANICAL RELIABILITY;

MICROELECTRONICS;

EID: 35348921123     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373803     Document Type: Conference Paper

References (23)

1. G.Q. Zhang, W.D. van Driel, and X.J. Fan. Mechanics of Microelectronics. Springer, Dordrecht, The Netherlands, ISBN 1-4020-4934-X, 2006.
2. C.D. Hartfield, E.T. Ogawa, Y.-J. Park, and T.-C. Chiu. Interface reliability assessments for Copper/low-k products. IEEE Transactions on Device and Materials Reliability, 4:129-141, 2004.
3. W.D. van Driel. Facing the challenge of designing for Cu/Low-k reliability. Microelectronics Reliability, accepted for publication, 2007.
4. X.H. Liu, M.W. Lane, T.M. Shaw, and E. Simonyi. Delamination in patterned films. International Journal of Solids and Structures, 44:1706-1718, 2007.
5. M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, and R.M.J. Voncken. Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability, 47:179-186, 2007.
6. O. van der Sluis, R.A.B. Engelen, W.D. van Driel, R.B.R. van Silfhout, and M.A.J. van Gils. Efficient damage sensitivity analysis of advanced Cu/Low-k bond pad structures using Area Release Energy, Microelectronics Reliability, accepted for publication, 2007.
7. M. F. Kanninen and C.H. Popelar, Advanced Fracture Mechanics. Oxford University Press, New York, 1985.
8. E.F. Rybicki and M.F. Kanninen, A finite element calculation of stress intensity factors by a modified crack closure integral. Engineering Fracture Mechanics, 9:931-938, 1977.
9. R.S. Barsoum. On the use of isoparametric finite elements in linear fracture mechanics. International Journal for Numerical Methods in Engineering, 10:23-37, 1976.
10. S.A. Smith and I.S. Raju. Evaluation of stress-intensity factors using general finite-element models. In TL Panontin and SD Sheppard, editors, Fatigue and Fracture Mechanics: 29th Volume, ASTM STP 1321. American Society for Testing and Materials, 1998.
11. G. Wang, P.S. Ho, and S. Groothuis. Chip-packaging interaction: a critical concern for Cu/low k packaging, Microelectronics Reliability, 45:1079-1093, 2005.
12. J.R. Rice. Elastic fracture mechanics concepts for interfacial cracks. Journal of Applied Mechanics, 55:98-103, 1988.
13. J.W. Hutchinson and Z. Suo. Mixed mode cracking in layered materials. Advances in Applied Mechanics, 29:63-191, 1992.
14. J.R. Rice and G.C. Sih. Plane problems of cracks in dissimilar media. Journal of Applied Mechanics, 32:418-423, 1965.
15. M.M. Abdel Wahab and G. de Roeck. A 2-D five-noded finite element to model power singularity, International Journal of Fracture, 74:89-97, 1995.
16. M.Y. He, A.G. Evans, and J.W. Hutchinson, Crack deflection at an interface between dissimilar elastic materials: Role of residual stresses. International Journal of Solids and Structures, 31: 3443-3455, 1994.
17. L.J. Ernst, W.D. van Driel, O. van der Sluis, A. Corigliano, A.A.O. Tay, N. Iwamoto, and M.M.F. Yuen. Fracture and delamination in microelectronics. Key Engineering Materials, accepted for publication, 2007.
18. R. Krueger, The virtual crack closure technique: history, approach and applications. NASA Report CR-2002-211628, 2002.
19. H. Tada, P.C. Paris, and G.R. Irwin. The stress analysis of cracks handbook. Paris Productions, St. Louis, 1985.
20. M.K. Kassir and A.M. Bregman. The stress-intensity factor for a penny-shaped crack between two dissimilar materials. Journal of Applied Mechanics, 39:308-310, 1972.
21. A.O. Ayhan, A.C. Kaya, and H.F. Nied. Analysis of three-dimensional interface cracks using enriched finite elements, International Journal of Fracture, 142:255-276, 2006.
22. S. Nemat-Nasser and M. Hori. Micromechanics: Overall Properties of Heterogeneous Materials. Elsevier, Amsterdam, 1994.
23. B.A.E. van Hal, R.H.J. Peerlings, M.G.D. Geers, and O. van der Sluis. Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectronics Reliability, accepted for publication, 2007.