Feature-extraction-based inspection algorithm for IC solder joints

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 5, 2011, Pages 689-694

  Wu, Fupei ^a   Zhang, Xianmin ^b  

^a SHANTOU UNIVERSITY   (China)

^b SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Automatic optical inspection; digital feature; integrated circuit component; logical feature; shape feature; solder joint

Indexed keywords

AUTOMATIC OPTICAL INSPECTION; DIGITAL FEATURE; INTEGRATED CIRCUIT COMPONENTS; LOGICAL FEATURE; SHAPE FEATURES; SOLDER JOINTS;

DEFECTS; DIGITAL INTEGRATED CIRCUITS; INSPECTION; OPTICAL PROPERTIES; OPTICAL TESTING; ORGANIC POLLUTANTS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS;

ALGORITHMS;

EID: 84859802291     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2118208     Document Type: Article

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