A new solder paste inspection device: Design and algorithm

Proceedings - IEEE International Conference on Robotics and Automation

Volumn , Issue , 2007, Pages 680-685

  Wu, Xinyu ^a   Chung, Wingkwong ^a   Tong, Hang ^a   Cheng, Jun ^a   Xu, Yangsheng ^a  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; IMAGE ACQUISITION; IMAGING SYSTEMS; SOLDERING ALLOYS; STATISTICAL METHODS;

HYBRID WEIGHTING ALGORITHM; SOLDER PASTE INSPECTION DEVICES;

INSPECTION EQUIPMENT;

EID: 36348968327     PISSN: 10504729     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ROBOT.2007.363065     Document Type: Conference Paper

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