Thermal and mechanical reliability tests of lead - Free soldered SMT joints

ISSE 2007 - 30th International Spring Seminar on Electronics Technology 2007; Conference Proceedings: Emerging Technologies for Electronics Packaging

Volumn , Issue , 2007, Pages 177-182

  Drozd, Z ^a   Szwech, M ^a   Kisiel, R ^a  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); BRAZING; COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EUROPIUM; FATIGUE TESTING; FIBER OPTIC SENSORS; HEALTH; LABORATORIES; LEAD; METALS; OSCILLATORS (ELECTRONIC); PACKAGING; SEMICONDUCTOR QUANTUM DOTS; SOLDERED JOINTS; SPEECH TRANSMISSION; SPRINGS (COMPONENTS); SURFACE MOUNT TECHNOLOGY; TECHNOLOGY; TESTING; TIN; TINNING; TITANIUM COMPOUNDS; VISUAL COMMUNICATION;

APPLIED (CO); CONFERENCE PROCEEDINGS; ELECTRONIC INTERCONNECTION; ELECTRONICS MANUFACTURING; ELECTRONICS TECHNOLOGY; EMERGING TECHNOLOGIES; EU DIRECTIVES; FATIGUE TESTS; FOUR POINT; HIGH-RELIABILITY; IMMERSION TIN (IMSN); INTERNATIONAL (CO); LEAD FREE; LEAD FREE TECHNOLOGIES; LEAD-FREE SOLDERED JOINTS; MECHANICAL CYCLING; MECHANICAL RELIABILITY; MECHANICAL TESTS; PILOT LINE; RELIABILITY DATA; RELIABILITY IMPROVEMENT; SOLDER JOINTS; VISUAL INSPECTION (VI); WARSAW UNIVERSITY OF TECHNOLOGY;

ELECTRONIC EQUIPMENT;

EID: 44849136630     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2007.4432843     Document Type: Conference Paper

References (12)

1. Drozd Z. Szwech M., Wrona R.: Characteristics of Accelerated Fatigue Teste by Cyclic Flexion of SMT PC Boards. Abstracts International Spring Seminar on Electronics Technology, Verlag Detert Dresden 2006, pp.82-83
2. Wrona R., Drozd Z., Szwech M.: Resistance Measurements of BGA Contacts During Reliability Tests. Abstracts International Spring Seminar on Electronics Technology, Verlag Detert Dresden 2006, pp. 70 - 71
3. D. Belavic, D. Rocak, M. Hrovat, J.Fajfar Plut, J. Pavlic, S. Macek, Z. Drozd, I. Mc Gill, K. Bukat: Substutution of ecologically hazardous substances in thick- film ceramic interconnection modules. Conference proceedings: Ecology in Electronics.PIE Warsaw,5-6 June 2006,pp.118-126
4. Drozd Z.: Reliability of Lead-Free Soldered Joints in Electronic Products. Prace Przemyslowego Insrytutu Elekroniki 153/2006, pp. 95-103.
5. Belavic D., Rocak D., Hrovat M., Fajfar-Plut J., Pavlic J., Macek S., Drozd, Z., Mc Gill I., Bukat K.: Substutution of ecologically hazardous substances in thick- film ceramic interconnection modules. Prace Przemyslowego Insrytutu Elekroniki 153/06, pp. 104-112.
6. Drozd Z., Szwech M., Drozd J.: Badania niezawodności oła̧czeń lutowanych bezołowiowych w projekcie Green RoSE. (In Polish) Proc. Workshop: Przemysł elektryczny i elektroniczny na dzień przed wejściem dyrektywy RoHS. Politechnika Koszalińska, Darlowo, June 2006,pp.33-38
7. Belavic D., Rocak D., Fajfar Plut J., Hrovat M., Pavlic J., Drozd Z., Macek S., Jan McGill, Bukat K.: An Introduction of RoHS Legislation in SMD Thick - Film Hybrid Technology - a Case Study. Proceedings Electronic Systemintegration Technology Conference ESTC 2006 Dresden 5 - 6.09.2006, pp.690 - 695.
8. Drozd Z., Szwech M.: Failure Modes and Fatigue Testing Characteristics of SMT Solder Joints. Proc. 1st Electronics Systemintegration Technology Conference ESTC 2006 Dresden 5 - 6.09.2006, pp.1187 - 1193.
9. J. Sitek J., Drozd Z, Bukat K, Arazna A.: Wettability of lead-free PCBs finishes after long-term natural storage. Proc. IMAPS Poland. 2006, Cracow 14 - 27.09.2006, pp. 235-238.
10. Sitek J., Drozd Z., Bukat K., Arazna A.: Wettability of lead-free PCBs finishes after long-term natural storage. Elektronika 12/2006, pp. 33-35
11. Z.Drozd: Presentations on Elfnet Meetings in Penteli, 25-27 Oct.2006 and Bordeaux, 30 Nov.-1Dec.2006.
12. K.J. Puttlitz (Editor): Handbook of Lead - Free Solder echnology for Microelectronic Assemblies. M.Detter Inc. N.Y 2004.1026 pages.