Printed circuit board inspection using image analysis

IEEE Transactions on Industry Applications

Volumn 35, Issue 2, 1999, Pages 426-432

  Loh, Horng Hai ^a   Lu, Ming Sing ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER VISION; IMAGE ANALYSIS; INSPECTION; PRINTED CIRCUIT TESTING; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

BRIDGED SOLDER JOINTS; SLANT MAP SURFACE SHAPE ESTIMATION TECHNIQUES;

PRINTED CIRCUIT BOARDS;

EID: 0033100207     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/28.753638     Document Type: Article

References (6)

1. W. Capson, "A tiered-color illumination approach for machine inspection of solder joints," IEEE Trans. Pattern Anal. Machine Intell., vol. 10, pp. 387-393, May 1988.
2. Y. Nakagawa, "Automatic visual inspection of solder joints on printed circuit boards," Proc. SPIE, vol. 336, 121-127, 1982.
3. A. C. Sanderson et al., "Structured highlight inspection of specular surfaces," IEEE Trans. Pattern Anal. Machine Intell., vol. 10, pp. 44-55, Jan. 1988.
4. R. J. K. Wassink, Soldering in Electronics. Ayr, U.K.: Electrochemical Publications, 1984, ch. 2, pp. 11-51.
5. S. Kobayashi et al., "Identifying solder surface orientation from color highlight images," in Proc. IECON'90, 1990, vol. 1, pp. 821-825.
6. H. H. Loh et al., "Printed circuit board inspection using image analysis," in P roc. 1995 Inter. IEEE/IAS Conf. Industrial Automation and Control, pp. 673-677.