Lead-free soldering effect to tantalum capacitors

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2003-January, Issue , 2003, Pages 85-89

  Zednicek, T ^a   Vasina, P ^a   Sita, Z ^a   Vrana, B ^a  

^a AVX Czech Republic   (Czech Republic)

Author keywords

Assembly; Capacitors; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Legislation; Soldering; Temperature; Thermal stresses; Tin

Indexed keywords

ASSEMBLY; CAPACITORS; CONSUMER ELECTRONICS; ELECTROLYTIC CAPACITORS; ENVIRONMENTAL IMPACT; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; INTERMETALLICS; LAWS AND LEGISLATION; LEAD; MANGANESE OXIDE; MANUFACTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SPECIFICATIONS; SURFACE MOUNT TECHNOLOGY; TANTALUM; TEMPERATURE; THERMAL STRESS; TIN; TIN ALLOYS;

COMPONENT TECHNOLOGIES; ELECTRONIC ASSEMBLIES; LEAD CONTAINING SOLDERS; LEAD-FREE SOLDER ALLOY; LIQUIDUS TEMPERATURE; MANUFACTURING TECHNIQUES; MATERIAL DEVELOPMENT; PRINT CIRCUIT BOARDS;

LEAD-FREE SOLDERS;

EID: 80053104039     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2003.1260489     Document Type: Conference Paper

References (5)

1. nd draft November 1999, www.ipc.org
2. Kühl, R.: Assuring Whisker-free Components, Pure Tin Applications in SMT, Beyschlag GmbH
3. Richards, B., Levoguer, C.&Hunt,C., Nimmo, K., Peters, S.& Cusack, P.: An Analysis of the Current Status of Lead-Free Soldering, National Physical Laboratory UK & ITRI Ltd
4. Charles, H.K., Sinnadurai, N.: Rising to the Environmental Challenge!?, The John Hopkins University USA & TWI Cambridge UK, IMAPS Proceeding 7-9 June 1999 Page 78.
5. Ishii, M., Kataoka, T., Kurihara, H.; Whisker Problem in the Ultra-fine Pitch Circuits, R&D Center Mitsui Mining & Smelting Co. Ltd, IMAPS Proceeding 7-9 June 1999 Page 379