A transient electrothermal analysis of three-dimensional integrated circuits

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 4, 2012, Pages 660-667

  Harris, T Robert ^a   Priyadarshi, Shivam ^a   Melamed, Samson ^a   Ortega, Carlos ^b   Manohar, Rajit ^b   Dooley, Steven R ^c   Kriplani, Nikhil M ^a   Davis, W Rhett ^a   Franzon, Paul D ^a   Steer, Michael B ^a  

^a North Carolina State University   (United States)

^b School of Operations Research and Industrial Engineering   (United States)

^c AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

3DIC; electrothermal effects; thermal management; transient analysis

Indexed keywords

3-D INTEGRATED CIRCUIT; 3DIC; COMPUTATIONALLY EFFICIENT; CUSTOM CELLS; DYNAMIC MODELING; ELECTRICAL NETWORKS; ELECTRO-THERMAL EFFECTS; ELECTRO-THERMAL SIMULATION; ELECTROTHERMAL ANALYSIS; ELECTROTHERMAL MACROMODELS; MAXIMUM FREQUENCY; MODEL ORDER REDUCTION; OPEN ACCESS; THERMAL NETWORK; THERMAL PROFILES; THREE DIMENSIONAL INTEGRATED CIRCUITS;

INTEGRATED CIRCUITS; TEMPERATURE CONTROL; THREE DIMENSIONAL COMPUTER GRAPHICS; TRANSIENT ANALYSIS;

THREE DIMENSIONAL;

EID: 84859738247     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2178414     Document Type: Article

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