Air cavity transmission lines for Off-Chip Interconnects Characterized to 40 GHz

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 3, 2012, Pages 367-374

  Spencer, Todd J ^a   Saha, Rajarshi ^a   Chen, Jikai ^b   Bashirullah, Rizwan ^b   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

^b University of Florida   (United States)

Author keywords

Air gap; interconnect; microstrip; off chip

Indexed keywords

AIR CAVITY; AIR-GAPS; CHIP-TO-CHIP COMMUNICATIONS; CONVENTIONAL MICROELECTRONICS; COPPER CONDUCTORS; EFFECTIVE DIELECTRIC CONSTANTS; HIGH-SPEED; INTERCONNECT; LOW LOSS; MICROSTRIPES; OFF-CHIP; OFF-CHIP INTERCONNECTS; PARALLEL PLATES; PARAMETER MEASUREMENT;

ELECTRIC LINES; MICROELECTRONICS; SCATTERING PARAMETERS; TRANSMISSION LINE THEORY;

COPPER;

EID: 84859084289     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2179045     Document Type: Article

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