The delay, energy, and bandwidth comparisons between copper, carbon nanotube, and optical interconnects for local and global wiring application

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 135-137

  Cho, Hoyeol ^a   Koo, Kyung Hoae ^a   Kapur, Pawan ^a   Saraswat, Krishna C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CARBON NANOTUBES; COPPER ALLOYS; CURRENT DENSITY; SUPERCONDUCTING WIRE;

GLOBAL WIRING APPLICATION; LOW-K WIRES; METRIC-BANDWIDTH DENSITY; PACKING DENSITY;

OPTICAL INTERCONNECTS;

EID: 34748917181     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382375     Document Type: Conference Paper

References (6)

1. P. J. Burke et.al, Trans. on Nanotechnology, vol. 1, no. 3, pp. 129-144, 2002.
2. J. Y. Park et.al, Nano Letters, vol.4, pp. 517-520, 2004
3. A. Naeemi et.al, Trans. on Electron Device, vol. 54, no.1, pp. 24-37, 2007.
4. H. Cho et.al, J. of Lightwave Technology, vol. 22, no. 9, pp. 2021-2033, 2004.
5. International technology roadmap of semiconductor, 2004.
6. K. Banerjee et.al, Trans. on Computer-Aided Design of Int. Circuits and Systems, vol. 21, no. 8, pp. 904-914, 2002.