Air-gaps for high-performance on-chip interconnect part I: Improvement in thermally decomposable template

Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1524-1533

  Park, Seongho ^a   Allen, Sue Ann Bidstrup ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Air gap; Damascene; Low k

Indexed keywords

32 NM TECHNOLOGY; AIR-CAVITIES; AIR-GAP; AIR-GAPS; DAMASCENE; LOW-K; NANOINDENTATION EXPERIMENTS; NORBORNENE; ON-CHIP INTERCONNECTS; POLYMER STRUCTURES; PROCESS REPEATABILITY; REPRODUCIBILITY; SOLID REACTIONS; TEMPLATING; TEMPLATING METHODS; THERMAL DECOMPOSITION; THIN FILMS; ULTRA LOW-K;

DECOMPOSITION; ELECTRONICS INDUSTRY; HARDNESS; INTEGRATED CIRCUITS; MOLECULAR BEAM EPITAXY; OPTICAL INTERCONNECTS; PHOTORESISTS; PYROLYSIS; THICK FILMS;

POLYMERS;

EID: 51849142608     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0514-4     Document Type: Article

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