Air-gap transmission lines on organic substrates for low-loss interconnects

IEEE Transactions on Microwave Theory and Techniques

Volumn 55, Issue 9, 2007, Pages 1919-1924

  Spencer, Todd J ^a,b   Joseph, Paul Jayachandran ^b   Kim, Tae Hong ^a,c   Swaminathan, Madhavan ^a,c   Kohl, Paul A ^a,b  

^a IEEE

^b Georgia Institute of Technology   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Air gaps; Dielectric losses; Multiprocessor interconnection; Transmission lines

Indexed keywords

CAPACITANCE; DIELECTRIC LOSSES; DIELECTRIC MATERIALS; INTERCONNECTION NETWORKS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; NATURAL FREQUENCIES; PERMITTIVITY; SUBSTRATES;

AIR-GAP; LOSS TANGENT; LOW-LOSS INTERCONNECTS; ORGANIC SUBSTRATES;

ELECTRIC LINES;

EID: 34548526865     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2007.904326     Document Type: Article

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