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Volumn 8263, Issue , 2012, Pages
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Novel process for direct bonding of GaN onto glass substrates using sacrificial ZnO template layers to chemically lift-off GaN from c-sapphire
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Author keywords
(In)GaN; Chemical Lift off; Direct Wafer Bonding; Glass Substrate; LED; Multijunction Photovoltaic; Selective Wet Etching; ZnO
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Indexed keywords
(IN)GAN;
DIRECT WAFER BONDING;
GLASS SUBSTRATE;
MULTIJUNCTION;
SELECTIVE WET ETCHING;
ZNO;
GLASS BONDING;
LIGHT EMITTING DIODES;
OPTICAL MICROSCOPY;
SAPPHIRE;
SCANNING ELECTRON MICROSCOPY;
SUBSTRATES;
WET ETCHING;
X RAY DIFFRACTION;
ZINC OXIDE;
ZINC SULFIDE;
GALLIUM NITRIDE;
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EID: 84858607386
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.916013 Document Type: Conference Paper |
Times cited : (11)
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References (16)
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