Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications

International Journal of Thermal Sciences

Volumn 56, Issue , 2012, Pages 77-85

  Koyuncuolu, Aziz ^a   Jafari, Rahim ^a   Okutucu Özyurt, Tuba ^a   Külah, Haluk ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Chip cooling; CMOS compatible; Electronics cooling; Hot spots; Microchannel heat sinks; Single phase convection

Indexed keywords

CHIP COOLING; CMOS COMPATIBLE; ELECTRONICS COOLING; HOT SPOT; MICROCHANNEL HEAT SINKS;

FABRICATION; HEAT FLUX; HEAT SINKS; LAMINAR FLOW; MICROCHANNELS; NUSSELT NUMBER;

ELECTRONIC COOLING;

EID: 84858280756     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2012.01.006     Document Type: Article

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