-
1
-
-
0019563707
-
High-performance heat sinking for VLSI
-
D. Tuckerman and R. Pease, "High-performance heat sinking for VLSI," Electron Device Letters, IEEE, vol. 2, 1981, pp. 126-129.
-
(1981)
Electron Device Letters, IEEE
, vol.2
, pp. 126-129
-
-
Tuckerman, D.1
Pease, R.2
-
2
-
-
33747624628
-
State of the art of high heat flux cooling technologies
-
B. Agostini, M. Fabbri, J. Park, L. Wojtan, J. Thome, and B. Michel, "State of the art of high heat flux cooling technologies," Heat Transfer Engineering, vol. 28, 2007, pp. 258-281.
-
(2007)
Heat Transfer Engineering
, vol.28
, pp. 258-281
-
-
Agostini, B.1
Fabbri, M.2
Park, J.3
Wojtan, L.4
Thome, J.5
Michel, B.6
-
4
-
-
27744449064
-
High heat flux removal with microchannels - A roadmap of challenges and opportunities
-
ASME, Toronto, Ontario, Canada, June
-
S.G. Kandlikar, "High heat flux removal with microchannels - a roadmap of challenges and opportunities," Third International Conference on Microchannels and Minichannels, ASME, Toronto, Ontario, Canada, June, 2005, pp. 13-15.
-
(2005)
Third International Conference on Microchannels and Minichannels
, pp. 13-15
-
-
Kandlikar, S.G.1
-
5
-
-
17644411021
-
Investigation of heat transfer in rectangular microchannels
-
P.S. Lee, S.V. Garimella, and D. Liu, "Investigation of heat transfer in rectangular microchannels," International Journal of Heat and Mass Transfer, vol. 48, 2005, pp. 1688-1704.
-
(2005)
International Journal of Heat and Mass Transfer
, vol.48
, pp. 1688-1704
-
-
Lee, P.S.1
Garimella, S.V.2
Liu, D.3
-
6
-
-
61849127340
-
Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics
-
F. Mei, W.A. Phillips, B. Lu, W.J. Meng, and S. Guo, "Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics," Journal of Micromechanics and Microengineering, vol. 19, 2009, p. 035009.
-
(2009)
Journal of Micromechanics and Microengineering
, vol.19
, pp. 035009
-
-
Mei, F.1
Phillips, W.A.2
Lu, B.3
Meng, W.J.4
Guo, S.5
-
7
-
-
18744382459
-
Flow characteristics in a trapezoidal silicon microchannel
-
P. Hao, F. He, and K. Zhu, "Flow characteristics in a trapezoidal silicon microchannel," Journal of Micromechanics and Microengineering, vol. 15, 2005, pp. 1362-1368.
-
(2005)
Journal of Micromechanics and Microengineering
, vol.15
, pp. 1362-1368
-
-
Hao, P.1
He, F.2
Zhu, K.3
-
8
-
-
0742269314
-
Planar CMOS compatible process for the fabrication of buried microchannels in silicon, using porous-silicon technology
-
G. Kaltsas, D.N. Pagonis, and A.G. Nassiopoulou, "Planar CMOS compatible process for the fabrication of buried microchannels in silicon, using porous-silicon technology," Journal of Microelectromechanical Systems, vol. 12, 2003, pp. 863-872.
-
(2003)
Journal of Microelectromechanical Systems
, vol.12
, pp. 863-872
-
-
Kaltsas, G.1
Pagonis, D.N.2
Nassiopoulou, A.G.3
-
9
-
-
0032100130
-
A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannels
-
I. Papautsky, J. Brazzle, H. Swerdlow, and A.B. Frazier, "A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannels," Journal of Microelectromechanical Systems, vol. 7, 1998, pp. 267-273.
-
(1998)
Journal of Microelectromechanical Systems
, vol.7
, pp. 267-273
-
-
Papautsky, I.1
Brazzle, J.2
Swerdlow, H.3
Frazier, A.B.4
-
10
-
-
58149330124
-
Air cooling of a microelectronic chip
-
Y. Joo, H.C. Yeh, K. Dieu, and C.J. Kim, "Air cooling of a microelectronic chip," Journal of Micromechanics and Microengineering, vol. 18, 2008, p. 115022.
-
(2008)
Journal of Micromechanics and Microengineering
, vol.18
, pp. 115022
-
-
Joo, Y.1
Yeh, H.C.2
Dieu, K.3
Kim, C.J.4
-
11
-
-
33947517616
-
Fabrication, modeling and testing of a thin film au/Ti microheater
-
K.L. Zhang, S.K. Chou, and S.S. Ang, "Fabrication, modeling and testing of a thin film Au/Ti microheater," International Journal of Thermal Sciences, vol. 46, 2007, pp. 580-588.
-
(2007)
International Journal of Thermal Sciences
, vol.46
, pp. 580-588
-
-
Zhang, K.L.1
Chou, S.K.2
Ang, S.S.3
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