Heat transfer in microchannels: Substrate effects and cooling efficiency for rectangular and circular ducts

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Dogruoz, M Baris ^a   Arik, Mehmet ^b   Pautsch, Adam ^b  

^a ANSYS INC   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Electronics cooling; Liquid cooling; Microchannel; Substrate; Thermal resistance; Thermodynamic efficiency

Indexed keywords

CIRCULAR DUCTS; COMPUTATIONAL DATA; COMPUTATIONAL STUDIES; CONDUCTION RESISTANCE; COOLING EFFICIENCY; CROSS-SECTIONAL SHAPE; ELECTRONICS COOLING; EXPERIMENTAL ANALYSIS; GEOMETRIC VARIABLES; GEOMETRICAL FEATURES; HEAT GENERATION RATE; HEAT REMOVAL; HEAT SINK MATERIALS; HIGH CONDUCTIVITY; HYDRAULIC DIAMETER; LAMINAR FLOW REGIMES; LIQUID COOLING; LIQUID COOLING TECHNOLOGY; MATERIAL PROPERTY; MICRO CHANNEL HEAT SINKS; PARETO CHARTS; SOURCE TEMPERATURE; SUBSTRATE EFFECTS; THERMAL CHARACTERISTICS; THERMAL RESISTANCE; THERMODYNAMIC EFFICIENCY; WALL HEAT TRANSFER; WORKING FLUID;

COOLING; DATA FLOW ANALYSIS; DUCTS; ELECTRONICS ENGINEERING; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; HYDRAULICS; LAMINAR FLOW; LEAKAGE (FLUID); LIQUIDS; MICROCHANNELS; SUBSTRATES; THERMODYNAMICS;

HEAT RESISTANCE;

EID: 77955223524     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501359     Document Type: Conference Paper

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