Air cooling of a microelectronic chip with diverging metal microchannels monolithically processed using a single mask

Journal of Micromechanics and Microengineering

Volumn 18, Issue 11, 2008, Pages

  Joo, Youngcheol ^a   Yeh, Hsin Chih Tim ^b   Dieu, Kiet ^b   Kim, Chang Jin ^b  

^a Soonchunhyang University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COOLING; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; METAL RECOVERY; MICROCHANNELS; THERMOANALYSIS;

AIR COOLING; AIR FLOWS; CHIP PACKAGING; HEAT REMOVAL CAPACITIES; IC FABRICATIONS; MASK PROCESSES; MICROELECTRONIC CHIPS; SMALL SIZES; SYSTEM IMPLEMENTATIONS; TEMPERATURE DROPS; THERMAL ANALYSIS;

ELECTRONICS PACKAGING;

EID: 58149330124     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/11/115022     Document Type: Article

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