Low-temperature bonding of silver to aluminum

Japanese Journal of Applied Physics

Volumn 51, Issue 2 PART 1, 2012, Pages

  Yasuda, Yusuke ^a   Terada, Shohei ^a   Morita, Toshiaki ^a   Kawaji, Hitoshi ^b  

^a HITACHI LTD   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM OXIDES; BONDING MATERIALS; BONDING PRESSURE; BONDING TEMPERATURES; CROSS SECTIONAL TRANSMISSION ELECTRON MICROSCOPY; DIRECT BONDING; LOW TEMPERATURE BONDING; SILVER ACETATE; SILVER POWDERS;

ALUMINUM; BONDING; ELECTRON ENERGY LOSS SPECTROSCOPY; ORGANOMETALLICS; OXIDES; SILVER OXIDES; SINTERED ALUMINA; SINTERING; TRANSMISSION ELECTRON MICROSCOPY; VOLATILE FATTY ACIDS;

SILVER;

EID: 84857313590     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.51.025001     Document Type: Article

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